Semiconductor device with gold bumps, and method and apparatus of producing the same

Invention Grant

US06495441B2 Semiconductor device with gold bumps, and method and apparatus of producing the same 失效

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Patent Title: Semiconductor device with gold bumps, and method and apparatus of producing the same
Application No.: US09533172

Application Date: 2000-03-22
Publication No.: US06495441B2

Publication Date: 2002-12-17
Inventor: Masayuki Kitajima , Masakazu Takesue , Yoshitaka Muraoka
Applicant: Masayuki Kitajima , Masakazu Takesue , Yoshitaka Muraoka
Priority: JP9-242459 19970908
Main IPC: H01L2144
IPC: H01L2144

Semiconductor device with gold bumps, and method and apparatus of producing the same

Abstract:

A semiconductor device comprises a semiconductor element having electrodes and metal bumps are attached to the electrodes. The metal bumps include copper cores and gold surface layers covering the cores. In addition, the metal bumps may include gold bump elements and solder bump elements connected together.

Public/Granted literature

US20020100972A1 Semiconductor device with gold bumps, and method and apparatus of producing the same Public/Granted day:2002-08-01

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