A thermoplastic molding composition comprising, (A) an aromatic polycarbonate; (B) a single rubber-free copolymer, e.g., of styrene and acrylonitrile; (C) a first graft polymer; (D) a second graft polymer; and (E) a wax, is described. The single rubber-free copolymer (B), and first and second graft polymers (C) and (D) are prepared from a specific selection of graft phases and graft bases. The graft base of the first graft polymer (C) comprises a crosslinked, particulate elastomer having an average particle diameter of 0.05 to 0.5 microns. The second graft polymer (D) has an average particle diameter of 0.6 to 20 microns. The thermoplastic compositions of the present invention are well suited for the preparation of molded articles that may be metalized over at least a portion of their surface by means of an electroless plating process. Such electroless plated articles are characterized as having improved heat resistance and adhesion of the metal plating.