公开(公告)号：US06503628B1

公开(公告)日：2003-01-07

申请号：US09538649

申请日：2000-03-30

申请人： Venkatarayaloo Janarthanan ,  Roland P. Brassard ,  Karl-Erwin Piejko ,  Sara D. Graham

发明人： Venkatarayaloo Janarthanan ,  Roland P. Brassard ,  Karl-Erwin Piejko ,  Sara D. Graham

IPC分类号： B32B2736

CPC分类号： C08L69/00 ,  C08L25/08 ,  C08L33/08 ,  C08L51/04 ,  C08L55/02 ,  Y10T428/31507 ,  C08L2666/02

摘要： A thermoplastic molding composition comprising, (A) an aromatic polycarbonate; (B) a single rubber-free copolymer, e.g., of styrene and acrylonitrile; (C) a first graft polymer; (D) a second graft polymer; and (E) a wax, is described. The single rubber-free copolymer (B), and first and second graft polymers (C) and (D) are prepared from a specific selection of graft phases and graft bases. The graft base of the first graft polymer (C) comprises a crosslinked, particulate elastomer having an average particle diameter of 0.05 to 0.5 microns. The second graft polymer (D) has an average particle diameter of 0.6 to 20 microns. The thermoplastic compositions of the present invention are well suited for the preparation of molded articles that may be metalized over at least a portion of their surface by means of an electroless plating process. Such electroless plated articles are characterized as having improved heat resistance and adhesion of the metal plating.

摘要翻译： 一种热塑性模塑组合物，其包含：（A）芳族聚碳酸酯; （B）单一无橡胶共聚物，例如苯乙烯和丙烯腈; （C）第一接枝聚合物; （D）第二接枝聚合物; 和（E）蜡。 单一无橡胶共聚物（B）和第一和第二接枝聚合物（C）和（D）由接枝相和接枝基材的特定选择制备。 第一接枝聚合物（C）的接枝基底包含平均粒径为0.05至0.5微米的交联的颗粒弹性体。 第二接枝聚合物（D）的平均粒径为0.6〜20微米。 本发明的热塑性组合物非常适用于通过化学镀方法制备可在其表面的至少一部分上金属化的模塑制品。 这种无电镀制品的特征在于具有改善的耐热性和金属镀层的粘合性。