发明授权
- 专利标题： Solid via layer to layer interconnect
- 专利标题（中）： 实体通过层间互连
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申请号： US09867312申请日： 2001-05-29
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公开(公告)号： US06504111B2公开(公告)日： 2003-01-07
- 发明人: Brian E. Curcio , Donald S. Farquhar , Voya R. Markovich , Konstantinos I. Papathomas
- 申请人： Brian E. Curcio , Donald S. Farquhar , Voya R. Markovich , Konstantinos I. Papathomas
- 主分类号： H05K111
- IPC分类号： H05K111
摘要：
The present invention relates to a structure for providing an interconnect between layers of a multilayer circuit board. The structure comprises a stack that includes at least one layer and a via opening that extends through at least one layer of the stack. Each individual via opening is filled with a solid conductive plug and each solid conductive plug has a first contact pad and a second contact pad.
公开/授权文献
- US20020179334A1 SOLID VIA LAYER TO LAYER INTERCONNECT 公开/授权日：2002-12-05
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