发明授权
- 专利标题： Negative resist composition, method for the formation of resist patterns and process for the production of electronic devices
- 专利标题（中）： 负电阻组合物，形成抗蚀剂图案的方法和用于生产电子器件的方法
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申请号： US09654433申请日： 2000-09-01
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公开(公告)号： US06506534B1公开(公告)日： 2003-01-14
- 发明人: Koji Nozaki , Takahisa Namiki , Ei Yano , Junichi Kon , Miwa Kozawa
- 申请人： Koji Nozaki , Takahisa Namiki , Ei Yano , Junichi Kon , Miwa Kozawa
- 优先权： JP11-248619 19990902; JP11-260815 19990914; JP2000-61090 20000306; JP2000-61091 20000306; JP2000-257661 20000828
- 主分类号： G03C1492
- IPC分类号： G03C1492
摘要：
The negative resist composition comprises (1) a film-forming polymer which is itself soluble in basic aqueous solutions, and contains a first monomer unit with an alkali-soluble group in the molecule and a second monomer unit with an alcohol structure on the side chain which is capable of reacting with the alkali-soluble group, and (2) a photo acid generator which, when decomposed by absorption of imaage-forming radiation, is capable of generating an acid that can induce reaction between the alcohol structure of the second monomer unit and the alkali-soluble group of the first monomer unit, or protect the alkali-soluble group of the first monomer unit. The resist composition can form intricate negative resist patterns with practical sensitivity and no swelling.
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