发明授权
- 专利标题: Packaging and assembly method for optical coupling
- 专利标题(中): 光耦合的封装和组装方法
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申请号: US09892921申请日: 2001-06-26
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公开(公告)号: US06512861B2公开(公告)日: 2003-01-28
- 发明人: Kishore K. Chakravorty , Ian A. Young , Joseph F. Ahadian , Johanna Marie Swan
- 申请人: Kishore K. Chakravorty , Ian A. Young , Joseph F. Ahadian , Johanna Marie Swan
- 主分类号: G02B612
- IPC分类号: G02B612
摘要:
A package allowing both electrical and optical coupling between one or more integrated circuits and a printed circuit board (PCB) has optical waveguide structures in addition to electrical connections. An optically active device may be flip-bonded directly to an integrated circuit using solder bump technology. The integrated circuit then flip-bonded or wire-bonded to a BGA package. The package has alignment rails or balls and V-grooves to anchor the alignment rails/balls to align the BGA package to the PCB. The BGA package is bonded to the PCB using solder reflow technology.
公开/授权文献
- US20020196997A1 PACKAGING AND ASSEMBLY METHOD FOR OPTICAL COUPLING 公开/授权日:2002-12-26