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公开(公告)号：US06512861B2
公开(公告)日：2003-01-28
申请号：US09892921
申请日：2001-06-26
IPC分类号： G02B612
CPC分类号： G02B6/43 , G02B6/42 , G02B6/4206 , G02B6/4212 , G02B6/4214 , G02B6/4231 , H05K1/0274 , H05K3/3436 , H05K2201/10121 , H05K2201/10734
摘要： A package allowing both electrical and optical coupling between one or more integrated circuits and a printed circuit board (PCB) has optical waveguide structures in addition to electrical connections. An optically active device may be flip-bonded directly to an integrated circuit using solder bump technology. The integrated circuit then flip-bonded or wire-bonded to a BGA package. The package has alignment rails or balls and V-grooves to anchor the alignment rails/balls to align the BGA package to the PCB. The BGA package is bonded to the PCB using solder reflow technology.
摘要翻译： 允许一个或多个集成电路和印刷电路板（PCB）之间的电和光耦合的封装除了电连接之外还具有光波导结构。 光学活性器件可以使用焊料凸点技术直接触发到集成电路。 然后将集成电路翻转或引线接合到BGA封装。 该包装具有对准轨道或球和V形槽，以锚定对准轨道/球以将BGA封装对准PCB。 使用焊锡回流技术将BGA封装结合到PCB。
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2.发明授权Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board 失效整合光学和电气设备并耦合到板上波导的倒装芯片封装公开(公告)号：US07049704B2
公开(公告)日：2006-05-23
申请号：US10840017
申请日：2004-05-06
申请人： Kishore K. Chakravorty , Johanna Swan , Brandon C. Barnett , Joseph F. Ahadian , Thomas P. Thomas , Ian Young
发明人： Kishore K. Chakravorty , Johanna Swan , Brandon C. Barnett , Joseph F. Ahadian , Thomas P. Thomas , Ian Young
IPC分类号： H01L29/40
CPC分类号： G02B6/42 , G02B6/4206 , G02B6/4212 , G02B6/4214 , G02B6/4231 , G02B6/43 , H05K1/0274 , H05K3/3436 , H05K2201/10121 , H05K2201/10734
摘要： A package allowing both electrical and optical coupling between one or more integrated circuits and a printed circuit board (PCB) has an optical waveguide structure in addition to electrical connections. An optically active device is flip-chip bonded directly to an integrated circuit using solder bump technology. The optically active device has a lens directly attached to it to facilitate optical coupling to the optical waveguide. The integrated circuit is flip-chip bonded to a Ball Grid Array (BGA) package. The BGA package is bonded to the PCB using solder reflow technology.
摘要翻译： 允许一个或多个集成电路和印刷电路板（PCB）之间的电和光耦合的封装除了电连接之外还具有光波导结构。 使用焊料凸块技术将光学有源器件直接贴合到集成电路上。 光学器件具有直接连接到其上的透镜，以便于光耦合到光波导。 集成电路倒装芯片结合到球栅阵列（BGA）封装。 使用焊锡回流技术将BGA封装结合到PCB。
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公开(公告)号：US07418163B2
公开(公告)日：2008-08-26
申请号：US10109313
申请日：2002-03-28
申请人： Kishore K. Chakravorty , Joseph F. Ahadian , Johanna Swan , Thomas P. Thomas , Brandon C. Barnett , Ian Young
发明人： Kishore K. Chakravorty , Joseph F. Ahadian , Johanna Swan , Thomas P. Thomas , Brandon C. Barnett , Ian Young
IPC分类号： G02B6/12
CPC分类号： G02B6/43 , G02B6/42 , G02B6/4214 , G02B6/4232 , G02B6/4249 , G02B6/4255 , G02B6/4257 , G02B6/426 , G02B6/428 , G02B6/4287
摘要： An integrated optoelectrical package for optoelectrical integrated circuits (ICs) is disclosed. The package includes a package substrate having contact receiving members on an upper surface. The contact receiving members are electrically connected to contacts on the lower surface. An optoelectronic receiver package and an optoelectronic transmitter package are each electrically mounted to respective first and second subsets of the contact receiving members. Input and output waveguide arrays are formed atop the substrate package and are optically coupled to the optoelectronic receiver package and the optoelectronic transmitter package, respectively. The contacts on the lower surface of the package substrate are designed to contact and engage the contact receiving members of a standard printed circuit board (PCB).
摘要翻译： 公开了一种用于光电集成电路（IC）的集成光电封装。 该封装包括在上表面上具有接触部件的封装基板。 触点接收构件电连接到下表面上的触点。 光电子接收器封装和光电发射器封装各自电连接到触点容纳部件的相应的第一和第二子集。 输入和输出波导阵列形成在衬底封装的顶部，并分别光耦合到光电接收器封装和光电发射器封装。 封装基板的下表面上的触点被设计成接触和接合标准印刷电路板（PCB）的触点接收构件。
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4.发明授权Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board 失效整合光学和电气设备并耦合到板上波导的倒装芯片封装公开(公告)号：US06754407B2
公开(公告)日：2004-06-22
申请号：US10158250
申请日：2002-05-30
申请人： Kishore K. Chakravorty , Johanna Swan , Brandon C. Barnett , Joseph F. Ahadian , Thomas P. Thomas , Ian Young
发明人： Kishore K. Chakravorty , Johanna Swan , Brandon C. Barnett , Joseph F. Ahadian , Thomas P. Thomas , Ian Young
IPC分类号： G02B612
CPC分类号： G02B6/42 , G02B6/4206 , G02B6/4212 , G02B6/4214 , G02B6/4231 , G02B6/43 , H05K1/0274 , H05K3/3436 , H05K2201/10121 , H05K2201/10734
摘要： A package allowing both electrical and optical coupling between one or more integrated circuits and a printed circuit board (PCB) has an optical waveguide structures in addition to electrical connections. An optically active device is flip-chip bonded directly to an integrated circuit using solder bump technology. The optically active device has a lens attached to it to facilitate optical coupling to the optical waveguide. The integrated circuit is flip-chip bonded to a Ball Grid Array (BGA) package. The BGA package is bonded to the PCB using solder reflow technology.
摘要翻译： 允许一个或多个集成电路和印刷电路板（PCB）之间的电和光耦合的封装除了电连接之外还具有光波导结构。 使用焊料凸块技术将光学有源器件直接贴合到集成电路上。 光学器件具有附接到其上的透镜以便于光耦合到光波导。 集成电路倒装芯片结合到球栅阵列（BGA）封装。 使用焊锡回流技术将BGA封装结合到PCB。
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公开(公告)号：US08335411B2
公开(公告)日：2012-12-18
申请号：US12617021
申请日：2009-11-12
CPC分类号： G02B6/4204 , G01N21/55 , G02B6/2938 , G02B6/32 , G02B6/4214 , G02B6/4246 , G02B6/4249 , Y10T29/49769
摘要： A component for coupling light bi-directionally between optical waveguides and optoelectronic devices is described. This component can be inexpensively manufactured and fits within the existing form-factor of fiber optic transceivers or transmitters, and has features for efficiently coupling laser light to a waveguide and light from the same waveguide to a detector. The described components can be formed as an array to operate within system that operation over parallel optical fibers. Applicability for these components is for optical time domain reflectometry, bi-directional optical communications, remote fiber sensing, and optical range finders.
摘要翻译： 描述了用于在光波导和光电子器件之间双向耦合光的组件。 该组件可以廉价地制造并且适合于现有的光纤收发器或发射器的形状因子，并且具有用于有效地将激光耦合到波导和从同一波导到检测器的光的特征。 所描述的部件可以形成为在平行光纤上操作的系统内操作的阵列。 这些组件的适用范围是光学时域反射测量，双向光通信，远程光纤传感和光学测距仪。
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公开(公告)号：US20110181364A1
公开(公告)日：2011-07-28
申请号：US12657727
申请日：2010-01-25
CPC分类号： H03F1/301 , H03F1/0261 , H03F1/223 , H03F3/2176 , H03F2200/18
摘要： Biasing methods and devices for power amplifiers are described. The described methods and devices use the power amplifier output voltage to generate bias voltages. The bias voltages are obtained using rectifiers and voltage dividers. The described biasing methods and devices can be used with class-E power amplifiers.
摘要翻译： 描述了用于功率放大器的偏置方法和装置。 所描述的方法和装置使用功率放大器输出电压来产生偏置电压。 使用整流器和分压器获得偏置电压。 所描述的偏置方法和装置可以与E类功率放大器一起使用。
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公开(公告)号：US20140099059A1
公开(公告)日：2014-04-10
申请号：US14117850
申请日：2012-05-15
IPC分类号： G02B6/42
CPC分类号： G02B6/4219 , G02B6/4201
摘要： A device structure and system for connecting optical waveguides to optical transmit and receive components is described. The structure is made of two parts. The lower part contains active optoelectronic components, such as lasers and photodetectors, and optical lenses. The lower part can be assembled by steps of aligning and bonding planar components. The upper part contains optical waveguides and lenses for coupling light into and out of the waveguides. The top part is mechanically connected to the lower part to form a mechanically sound connection. The lens system provides some tolerance to mis-alignment between the top and bottom parts. The system has features that enable fiber optic components to operate and survive in harsh environments, particularly large temperature extremes.
摘要翻译： 描述了用于将光波导连接到光发射和接收部件的装置结构和系统。 该结构由两部分组成。 下部包含有源光电子元件，如激光和光电探测器，以及光学透镜。 下部可以通过对齐和粘合平面部件的步骤组装。 上部包含用于将光耦合到和流出波导的光波导和透镜。 顶部机械地连接到下部以形成机械声音连接。 透镜系统为顶部和底部之间的对准错误提供了一些公差。 该系统具有使光纤组件能够在恶劣环境，特别是极端温度极端运行和生存的功能。
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公开(公告)号：US20130094026A1
公开(公告)日：2013-04-18
申请号：US13692366
申请日：2012-12-03
CPC分类号： G02B6/4204 , G01N21/55 , G02B6/2938 , G02B6/32 , G02B6/4214 , G02B6/4246 , G02B6/4249 , Y10T29/49769
摘要： A component for coupling light bi-directionally between optical waveguides and optoelectronic devices is described. This component can be inexpensively manufactured and fits within the existing form-factor of fiber optic transceivers or transmitters, and has features for efficiently coupling laser light to a waveguide and light from the same waveguide to a detector. The described components can be formed as an array to operate within system that operation over parallel optical fibers. Applicability for these components is for optical time domain reflectometry, bi-directional optical communications, remote fiber sensing, and optical range finders.
摘要翻译： 描述了用于在光波导和光电子器件之间双向耦合光的组件。 该组件可以廉价地制造并且适合于现有的光纤收发器或发射器的形状因子，并且具有用于有效地将激光耦合到波导和从同一波导到检测器的光的特征。 所描述的部件可以形成为在平行光纤上操作的系统内操作的阵列。 这些组件的适用范围是光学时域反射测量，双向光通信，远程光纤传感和光学测距仪。
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公开(公告)号：US07026883B2
公开(公告)日：2006-04-11
申请号：US10801395
申请日：2004-03-12
申请人： Harish Muthali , Ian Young , Joseph F. Ahadian
发明人： Harish Muthali , Ian Young , Joseph F. Ahadian
IPC分类号： H03B5/04
CPC分类号： H03B5/04 , H03B5/1215 , H03B5/1228 , H03B5/1243 , H03B2200/0062 , H03B2200/0066
摘要： A voltage-controlled oscillator includes an inductor capacitor (LC) tank; a drive circuit having a current source; and a feedback loop circuit. The feedback loop includes a peak detect circuit to generate a peak detect voltage; a reference voltage generator to generate a single reference voltage; and an operational amplifier, coupled to the peak detect circuit and the reference voltage generator, to generate an analog bias signal to adjust a current of the current source.
摘要翻译： 压控振荡器包括电感电容器（LC）箱; 具有电流源的驱动电路; 和反馈回路电路。 反馈回路包括产生峰值检测电压的峰值检测电路; 参考电压发生器，用于产生单个参考电压; 以及耦合到峰值检测电路和参考电压发生器的运算放大器，以产生模拟偏置信号以调节电流源的电流。
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10.发明授权Silicon on III-V semiconductor bonding for monolithic optoelectronic integration 失效硅在III-V半导体接合单片光电集成公开(公告)号：US06455398B1
公开(公告)日：2002-09-24
申请号：US09616456
申请日：2000-07-14
IPC分类号： H01L2130
CPC分类号： H01L21/8252 , G02B6/1245 , H01L21/187 , H01L21/2007 , H01L21/76251 , H01L21/76254 , H01L21/76256 , H01L21/8258 , H01L27/0605 , H01L27/0688 , H01L2221/68363
摘要： In a method for bonding a silicon substrate to a III-V material substrate, a silicon substrate is contacted together with a III-V material substrate and the contacted substrates are annealed at a first temperature that is above ambient temperature, e.g., at a temperature of between about 150° C. and about 350° C. The silicon substrate is then thinned. This bonding process enables the fabrication of thick, strain-sensitive and defect-sensitive optoelectronic devices on the optimum substrate for such, namely, a thick III-V material substrate, while enabling the fabrication of silicon electronic devices in a thin silicon layer, resulting from the thinned Si substrate, that is sufficient for such fabrication but which has been thinned to eliminate thermally-induced stress in both the Si and III-V materials. The III-V material substrate thickness thereby provides the physical strength of the composite substrate structure, while the thinned silicon substrate minimizes stress in the composite structure.
摘要翻译： 在将硅衬底接合到III-V材料衬底的方法中，硅衬底与III-V材料衬底接触，并且接触衬底在高于环境温度的第一温度例如温度 在约150℃和约350℃之间。然后使硅衬底变薄。 这种接合工艺使得能够在最佳衬底上制造厚的，应变敏感的和缺陷敏感的光电子器件用于例如厚的III-V材料衬底，同时能够在薄的硅层中制造硅电子器件，从而产生 来自薄化的Si衬底，这对于这种制造是足够的，但已被稀释以消除Si和III-V材料中的热诱导应力。 因此，III-V材料衬底厚度提供了复合衬底结构的物理强度，而薄化硅衬底使复合结构中的应力最小化。
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