发明授权
- 专利标题： Polymer and ceramic composite electronic substrates
- 专利标题（中）： 聚合物和陶瓷复合电子基板
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申请号： US09606359申请日： 2000-06-29
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公开(公告)号： US06528145B1公开(公告)日： 2003-03-04
- 发明人: Daniel George Berger , Shaji Farooq , Lester Wynn Herron , James N. Humenik , John Ulrich Knickerbocker , Robert William Pasco , Charles H. Perry , Krishna G. Sachdev
- 申请人： Daniel George Berger , Shaji Farooq , Lester Wynn Herron , James N. Humenik , John Ulrich Knickerbocker , Robert William Pasco , Charles H. Perry , Krishna G. Sachdev
- 主分类号： G02B600
- IPC分类号： G02B600
摘要：
A composite electronic and/or optical substrate including polymeric and ceramic material wherein the composite substrate has a dielectric constant less than 4 and a coefficient of thermal expansion of 8 to 14 ppm/°C. at 100° C. The composite substrate may be either ceramic-filled polymeric material or polymer-filled ceramic material.
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