公开(公告)号：US07278207B2

公开(公告)日：2007-10-09

申请号：US11182167

申请日：2005-07-15

申请人： Lisa J. Jimarez ,  Miguel A. Jimarez ,  Voya R. Markovich ,  Cynthia S. Milkovich ,  Charles H. Perry ,  Brenda L. Peterson

发明人： Lisa J. Jimarez ,  Miguel A. Jimarez ,  Voya R. Markovich ,  Cynthia S. Milkovich ,  Charles H. Perry ,  Brenda L. Peterson

IPC分类号： H01K3/10 ,  H01R12/04 ,  H01L21/00

CPC分类号： H01L21/4857 ,  H01L21/486 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3457 ,  H05K3/4053 ,  H05K3/4069 ,  H05K3/4605 ,  H05K3/4644 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/015 ,  H05K2201/09436 ,  H05K2201/09509 ,  H05K2201/10734 ,  H05K2203/061 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49165 ,  H01L2924/00

摘要： An electronic package and method of making the electronic package is provided. A layer of dielectric material is positioned on a first surface of a substrate which includes a plurality of conductive contacts. At least one through hole is formed in the layer of dielectric material in alignment with at least one of the plurality of conductive contacts. A conductive material is positioned in the at least one through hole substantially filling the through hole. At least one conductive member is positioned on the conductive material in the through hole and in electrical contact with the conductive material. The electronic package improves field operating life of an assembly which includes a semiconductor chip attached to a second surface of the substrate and a printed wiring board attached to the conductive members.

公开(公告)号：US06486415B2

公开(公告)日：2002-11-26

申请号：US09761124

申请日：2001-01-16

申请人： Lisa J. Jimarez ,  Miguel A. Jimarez ,  Voya R. Markovich ,  Cynthia S. Milkovich ,  Charles H. Perry ,  Brenda L. Peterson

发明人： Lisa J. Jimarez ,  Miguel A. Jimarez ,  Voya R. Markovich ,  Cynthia S. Milkovich ,  Charles H. Perry ,  Brenda L. Peterson

IPC分类号： H01P1204

CPC分类号： H01L21/4857 ,  H01L21/486 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3457 ,  H05K3/4053 ,  H05K3/4069 ,  H05K3/4605 ,  H05K3/4644 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/015 ,  H05K2201/09436 ,  H05K2201/09509 ,  H05K2201/10734 ,  H05K2203/061 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49165 ,  H01L2924/00

摘要： An electronic package and method of making the electronic package is provided. A layer of dielectric material is positioned on a first surface of a substrate which includes a plurality of conductive contacts. At least one through hole is formed in the layer of dielectric material in alignment with at least one of the plurality of conductive contacts. A conductive material is positioned in the at least one through hole substantially filling the through hole. At least one conductive member is positioned on the conductive material in the through hole and in electrical contact with the conductive material. The electronic package improves field operating life of an assembly which includes a semiconductor chip attached to a second surface of the substrate and a printed wiring board attached to the conductive members.

摘要翻译： 提供电子封装和制造电子封装的方法。 电介质材料层位于包括多个导电触点的衬底的第一表面上。 至少一个通孔形成在电介质材料层中，与多个导电触点中的至少一个对准。 导电材料位于基本上填充通孔的至少一个通孔中。 至少一个导电构件定位在通孔中的导电材料上并与导电材料电接触。 该电子封装提高了组件的现场使用寿命，该组件包括附接到衬底的第二表面的半导体芯片和附着到导电构件的印刷线路板。

公开(公告)号：US6038931A

公开(公告)日：2000-03-21

申请号：US25672

申请日：1998-02-18

申请人： David C. Long ,  Thomas P. Moyer ,  Keith C. O'Neil ,  Charles H. Perry ,  Glenn A. Pomerantz ,  James R. Case ,  Laszlo Kando ,  John E. Kozol

发明人： David C. Long ,  Thomas P. Moyer ,  Keith C. O'Neil ,  Charles H. Perry ,  Glenn A. Pomerantz ,  James R. Case ,  Laszlo Kando ,  John E. Kozol

IPC分类号： G01N3/24 ,  G01N3/20

CPC分类号： G01N3/24

摘要： A method for testing the integrity at least two test objects, each object is made of a plastically deformable material, by a. contacting a moving means with the objects at a first point in time, the moving means at a first position and the objects at a first position, the moving means having a shaped portion; b. shifting at least a portion of the objects to a second position at a second time, subsequent to the first time, wherein at least a portion of the objects were displaced during the interval between the first time and the second time; c. evaluating the objects after the shifting in step b. 22.

摘要翻译： 一种用于测试至少两个测试对象的完整性的方法，每个对象由可塑性变形的材料制成，由a。 在第一时间点将移动装置与物体接触，移动装置处于第一位置，并且物体处于第一位置，移动装置具有成形部分; b。 在第一次之后的第二时间将至少一部分物体移动到第二位置，其中至少一部分物体在第一时间和第二时间之间的间隔期间被移位; C。 在步骤b中移动后评估对象。 22。

公开(公告)号：US5532608A

公开(公告)日：1996-07-02

申请号：US417623

申请日：1995-04-06

申请人： Abbas Behfar-Rad ,  Charles H. Perry ,  Krishna G. Sachdev

发明人： Abbas Behfar-Rad ,  Charles H. Perry ,  Krishna G. Sachdev

IPC分类号： G01R31/26 ,  G01R1/073 ,  H05K3/28 ,  H05K9/00 ,  G01R15/12

CPC分类号： G01R1/07307

摘要： An electrical probe card for parametric testing of microelectronics having reduced leakage current, includes a hydrophobic layer of a self curing silicone material coating the entire exposed surface of the ceramic card between exposed conductors. The hydrophobic layer has a thickness of less than 1 micrometer, preferably less than 0.1 micrometer and most preferably between 0.01 and 0.001 micrometers. The hydrophobic layer does not interfere with subsequent soldering to the contacts on the card, is inexpensive, solvent resistant and easily applied to new and pre-existing probe cards. The method of application involves applying an excess of the hydrophobic silicone material in its uncured state, followed by vigorously wiping excess material off to thin the layer, produce a good bond and clean the exposed conductors on the probe card.

摘要翻译： 用于具有减小的漏电流的微电子学参数测试的电探针卡包括在裸露导体之间涂覆陶瓷卡的整个暴露表面的自固化硅氧烷材料的疏水层。 疏水层的厚度小于1微米，优选小于0.1微米，最优选为0.01至0.001微米。 疏水层不会干扰随后焊接到卡上的触点，价格低廉，耐溶剂性，并且易于应用于新的和预先存在的探针卡。 施用方法包括将过量的疏水性硅氧烷材料应用于其未固化状态，然后剧烈擦拭多余的材料以使层变薄，产生良好的粘结并清洁探针卡上的暴露的导体。

公开(公告)号：US5398923A

公开(公告)日：1995-03-21

申请号：US58294

申请日：1993-05-06

申请人： Charles H. Perry ,  Robert G. Nelson

发明人： Charles H. Perry ,  Robert G. Nelson

IPC分类号： B66D5/04 ,  B66D5/06 ,  F16D51/00 ,  F16D67/00 ,  B66D5/02 ,  B66D1/22 ,  B66D5/14

CPC分类号： F16D67/00 ,  B66D5/04 ,  B66D5/06 ,  F16D51/00

摘要： A power operated drive shaft and brake assembly are coaxially mounted for rotation inside a cable drum which is coupled to the drive shaft through gearing. The brake assembly has an adapter housing and one-way clutch for drivingly connecting the drive shaft and adapter housing during a "cable out" operation. A plurality of brake pads are mounted for movement relative to the brake adapter housing. The brake pads are angularly offset in a non-radial orientation to negate undesired brake drag caused by centrifugal forces while the pads are spring loaded to provide a predetermined braking force to hold a load in place after completion of a winching operation.

摘要翻译： 动力驱动的驱动轴和制动器组件同轴地安装用于在电缆鼓内旋转，电缆鼓通过齿轮联接到驱动轴。 制动器组件具有适配器壳体和单向离合器，用于在“电缆输出”操作期间驱动地连接驱动轴和适配器壳体。 安装多个制动衬块以相对于制动适配器壳体移动。 制动衬块以非径向方向成角度地偏移，以消除由离心力引起的不期望的制动阻力，同时垫被弹簧加载以提供预定的制动力，以在完成绞车操作之后将负载保持在适当位置。

公开(公告)号：US4684339A

公开(公告)日：1987-08-04

申请号：US873906

申请日：1986-06-13

申请人： Raschid J. Bezama ,  Charles H. Perry

发明人： Raschid J. Bezama ,  Charles H. Perry

IPC分类号： B28B3/00 ,  B28B11/00 ,  B30B1/00 ,  B30B5/02 ,  C04B35/64

CPC分类号： B30B1/003 ,  Y10S425/11

摘要： A gas-loaded diaphragm for exerting a predetermined pressure on a ceramic substrate during sintering to prevent x-y shrinkage. In the most preferred embodiment, the diaphragm comprises a gas-filled base composed of two opposing discs, and a substantially hollow gas-filled toroid container disposed around the perimeter of the opposing discs and communicating therewith to permit gas flow therebetween. This diaphragm is disposed in relation to a ceramic substrate-containing cell so that when it is heated to a desired temperature, the gas in the diaphragm expands and forces the two opposing discs apart to thereby exert a predetermined pressure on the ceramic substrate-containing cell.

摘要翻译： 一种用于在烧结过程中在陶瓷衬底上施加预定压力以防止x-y收缩的气体隔膜。 在最优选的实施例中，隔膜包括由两个相对的盘组成的充气基座，以及设置在相对盘的周边周围并与其连通以允许气体在其间流动的基本上中空的气体填充的环形容器。 该隔膜相对于含陶瓷基板的电池设置，使得当其被加热到期望的温度时，隔膜中的气体膨胀并且迫使两个相对的盘分开，从而在含陶瓷衬底的电池上施加预定压力 。

公开(公告)号：US06528145B1

公开(公告)日：2003-03-04

申请号：US09606359

申请日：2000-06-29

申请人： Daniel George Berger ,  Shaji Farooq ,  Lester Wynn Herron ,  James N. Humenik ,  John Ulrich Knickerbocker ,  Robert William Pasco ,  Charles H. Perry ,  Krishna G. Sachdev

发明人： Daniel George Berger ,  Shaji Farooq ,  Lester Wynn Herron ,  James N. Humenik ,  John Ulrich Knickerbocker ,  Robert William Pasco ,  Charles H. Perry ,  Krishna G. Sachdev

IPC分类号： G02B600

CPC分类号： H05K1/0373 ,  H01L21/4857 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K3/4611 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/068 ,  Y10S428/901 ,  Y10T428/24273 ,  Y10T428/24479 ,  Y10T428/24917 ,  Y10T428/24942 ,  Y10T428/249955 ,  Y10T428/249956 ,  Y10T428/251 ,  Y10T428/254 ,  Y10T428/259 ,  H01L2924/00

摘要： A composite electronic and/or optical substrate including polymeric and ceramic material wherein the composite substrate has a dielectric constant less than 4 and a coefficient of thermal expansion of 8 to 14 ppm/°C. at 100° C. The composite substrate may be either ceramic-filled polymeric material or polymer-filled ceramic material.

摘要翻译： 包括聚合物和陶瓷材料的复合电子和/或光学基底，其中复合基底具有小于4的介电常数和8-14ppm /℃的热膨胀系数。 在100℃下。复合衬底可以是陶瓷填充的聚合材料或聚合物填充的陶瓷材料。

公开(公告)号：US5277725A

公开(公告)日：1994-01-11

申请号：US881448

申请日：1992-05-11

申请人： John Acocella ,  Peter A. Agostino ,  Arnold I. Baise ,  Richard A. Bates ,  Ray M. Bryant ,  Jon A. Casey ,  David R. Clarke ,  George Czornyj ,  Allen J. Dam ,  Lawrence D. David ,  Renuka S. Divakaruni ,  Werner E. Dunkel ,  Ajay P. Giri ,  Liang-Choo Hsia ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Anthony Mastreani ,  Amy T. Matts ,  Robert W. Nufer ,  Charles H. Perry ,  Srinivasa S. N. Reddy ,  Salvatore J. Scilla ,  Mark A. Takacs ,  Lovell B. Wiggins

发明人： John Acocella ,  Peter A. Agostino ,  Arnold I. Baise ,  Richard A. Bates ,  Ray M. Bryant ,  Jon A. Casey ,  David R. Clarke ,  George Czornyj ,  Allen J. Dam ,  Lawrence D. David ,  Renuka S. Divakaruni ,  Werner E. Dunkel ,  Ajay P. Giri ,  Liang-Choo Hsia ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Anthony Mastreani ,  Amy T. Matts ,  Robert W. Nufer ,  Charles H. Perry ,  Srinivasa S. N. Reddy ,  Salvatore J. Scilla ,  Mark A. Takacs ,  Lovell B. Wiggins

IPC分类号： H05K1/03 ,  C04B41/48 ,  C04B41/49 ,  H01L21/48 ,  H01L23/08 ,  H01L23/538 ,  H05K3/40 ,  C04B37/00 ,  B05D5/12

CPC分类号： H01L21/4857 ,  C04B41/488 ,  C04B41/4961 ,  H01L23/5383 ,  H05K3/4061 ,  C04B2111/00672 ,  C04B2111/00844 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K1/0306 ,  H05K2201/09581 ,  H05K2203/1147 ,  H05K2203/308

摘要： The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

摘要翻译： 在金属的热循环过程中经历的裂纹：电介质半导体封装是由热膨胀系数不匹配引起的。 与这种开裂相关的非气密性可以通过用柔性材料回填可渗透裂缝来解决。 金属和电介质材料之间的均匀间隙可以类似地填充柔性材料，以提供应力消除，体积可压缩性和包装的强度。 此外，可渗透的骨架电介质可以被制造为具有烧结冶金的烧结多层结构，并随后注入柔性的温度稳定的材料以提供气密性和强度。

公开(公告)号：US06548175B2

公开(公告)日：2003-04-15

申请号：US09759012

申请日：2001-01-11

申请人： Krishna G. Sachdev ,  Raymond A. Jackson ,  Amy B. Ostrander ,  Charles H. Perry ,  Megan J. Shannon

发明人： Krishna G. Sachdev ,  Raymond A. Jackson ,  Amy B. Ostrander ,  Charles H. Perry ,  Megan J. Shannon

IPC分类号： B32B2738

CPC分类号： H01L24/83 ,  C08G59/306 ,  C08G59/3254 ,  C08G59/38 ,  C08L63/00 ,  C09J9/02 ,  C09J163/00 ,  H01L24/29 ,  H01L2224/13111 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29364 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K3/321 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31663 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014

摘要： The invention is directed to improved conductive adhesives for solder-free interconnections in microelectronic assembly processes such as for chip carrier-to-substrate attachment. These adhesives are characterized by low tensile modulus, low resistivity, high adhesion strength, and durability of these properties during reliability stress conditions of thermal shock, thermal aging, and temperature/humidity (85° C./85%) exposure of the assembled devices. The adhesives contain a homogeneous solution of a siloxane containing epoxide, a curing agent, a curing catalyst and an organic polymeric or oligomeric additive. A conductive filler is added to the solution forming the filler. Preferred fillers are Ag coated with Pd and Ag coated with Au.

公开(公告)号：US06404211B2

公开(公告)日：2002-06-11

申请号：US09248733

申请日：1999-02-11

申请人： Harvey C. Hamel ,  Charles H. Perry ,  Yuet-Ying Yu

发明人： Harvey C. Hamel ,  Charles H. Perry ,  Yuet-Ying Yu

IPC分类号： G01R3102

CPC分类号： G01R1/07357

摘要： A buckling beam probe assembly and a process to make the assembly using insulated metal to hold the vertical beam probe wires. The buckling beam probe assembly electrically connects a test apparatus with contact pads on the surface of a device to be tested. The assembly is formed with a plurality of buckling beam wires each having a head, a body, and a tail. Each of the beam wires is pressed vertically onto the contact pads and buckles laterally to adapt to height differences of the contact pads caused by irregularities on the surface of the device to be tested. A top plate has a first plurality of apertures receiving the heads of the plurality of buckling beam wires. A bottom plate has a second plurality of apertures receiving the tails of the plurality of buckling beams wires. A plurality of intermediate metal sections are positioned between the top plate and the bottom plate. Each of the intermediate metal sections is formed with a plurality of thin metal layers and has a plurality of openings coated with an insulation layer. The bodies of the plurality of buckling beam wires pass through the openings.

摘要翻译： 屈曲梁探头组件和使用绝缘金属组装以保持垂直梁探针线的工艺。 屈曲梁探针组件将测试装置与待测试装置的表面上的接触垫电连接。 组件形成有多个屈曲束线，每个弯曲束线具有头部，主体和尾部。 每根光束线被垂直地按压到接触垫上并且侧向弯曲，以适应由待测试装置的表面上的不规则引起的接触垫的高度差。 顶板具有容纳多个屈曲束线的头部的第一多个孔。 底板具有接收多个弯曲梁线的尾部的第二多个孔。 多个中间金属部分位于顶板和底板之间。 每个中间金属部分形成有多个薄金属层，并且具有涂覆有绝缘层的多个开口。 多个屈曲束线的主体穿过开口。