发明授权
- 专利标题： Shapes-based migration of aluminum designs to copper damascene
- 专利标题（中）： 基于形状的铝设计迁移到铜镶嵌
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申请号： US09670411申请日： 2000-09-26
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公开(公告)号： US06528883B1公开(公告)日： 2003-03-04
- 发明人: Timothy G. Dunham , Ezra D. B. Hall , Howard S. Landis , Mark A. Lavin , William C. Leipold
- 申请人： Timothy G. Dunham , Ezra D. B. Hall , Howard S. Landis , Mark A. Lavin , William C. Leipold
- 主分类号： H01L2348
- IPC分类号： H01L2348
摘要：
An interconnect structure for use in semiconductor devices which interconnects a plurality of dissimilar metal wiring layers, which are connected vias, by incorporating shaped voids in the metal layers. The invention also discloses a method by which such structures are constructed.
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