发明授权
- 专利标题: Cover connecting mechanism
- 专利标题(中): 盖连接机构
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申请号: US09874834申请日: 2001-06-05
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公开(公告)号: US06530792B2公开(公告)日: 2003-03-11
- 发明人: Chengshing Lai , Wenyuan Huang
- 申请人: Chengshing Lai , Wenyuan Huang
- 优先权: CN00116618 20000620
- 主分类号: H01R300
- IPC分类号: H01R300
摘要:
The present invention provides a cover connecting mechanism which is used for connecting the cover to the main body of an electronic product, including: at least one FPC used for communication data amission; a connector made of elastically deformable material which partially wraps the FPC while exposing its two ends. The two exposed FPC ends are connected to the cover and the printed circuit board in the main body to enable the transmission of communication data.
公开/授权文献
- US20020067590A1 Cover connecting mechanism 公开/授权日:2002-06-06
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