• 专利标题: Thermal heating board
  • 申请号: US09907013
    申请日: 2001-07-17
  • 公开(公告)号: US06533185B1
    公开(公告)日: 2003-03-18
  • 发明人: Morgan Muir
  • 申请人: Morgan Muir
  • 主分类号: F24D510
  • IPC分类号: F24D510
Thermal heating board
摘要:
An improved hydronic radiant heating system comprising a nonstructural board having a recess formed in one surface of said board, a pipe located within said recess, and, if desired, a film of metal covering said surface of said board and having a thickness proportional to the thermal properties of said board to provide desired overall thermal characteristics for said heating system.
信息查询
0/0