- 专利标题: Thermal heating board
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申请号: US09907013申请日: 2001-07-17
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公开(公告)号: US06533185B1公开(公告)日: 2003-03-18
- 发明人: Morgan Muir
- 申请人: Morgan Muir
- 主分类号: F24D510
- IPC分类号: F24D510
摘要:
An improved hydronic radiant heating system comprising a nonstructural board having a recess formed in one surface of said board, a pipe located within said recess, and, if desired, a film of metal covering said surface of said board and having a thickness proportional to the thermal properties of said board to provide desired overall thermal characteristics for said heating system.
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