发明授权
- 专利标题: Dual level contacts and method for forming
- 专利标题(中): 双层接触和成型方法
-
申请号: US09521977申请日: 2000-03-09
-
公开(公告)号: US06534389B1公开(公告)日: 2003-03-18
- 发明人: Thomas G. Ference , Kurt R. Kimmel , Alain Loiseau , Jed H. Rankin
- 申请人: Thomas G. Ference , Kurt R. Kimmel , Alain Loiseau , Jed H. Rankin
- 主分类号: H01L213205
- IPC分类号: H01L213205
摘要:
A method for making electrical contacts to device regions in a semiconductor substrate, and the resulting structure, is presented. A first set of borderless contacts is initially formed. This first set of contacts is then contacted by a second series of smaller, upper-level contacts. The second set of contacts also contact the gate of the device. The structure which results has a form wherein there are stacked contacts to the diffusion layer, and a single level contact to the device gate. The structure further provides local interconnectability over gate structures.
信息查询