- 专利标题： Enhanced design and process for a conductive adhesive
-
申请号： US08864044申请日： 1997-05-28
-
公开(公告)号： US06534724B1公开(公告)日： 2003-03-18
- 发明人: Donald Seton Farquhar , Gerard Paul Kohut , Andrew Michael Seman , Michael Joseph Klodowski
- 申请人： Donald Seton Farquhar , Gerard Paul Kohut , Andrew Michael Seman , Michael Joseph Klodowski
- 主分类号： H05K102
- IPC分类号： H05K102
摘要：
The present invention provides a new device and method for enhancing the electrical properties of the thick metal backer/electrically conductive thermoset adhesive/printed circuit board or card assembly. The enhanced electrical properties are obtained by providing a thin bondline of conductive adhesive that is essentially void free.
信息查询
