The invention comprises a semiconductor device with protection circuitry and a method of protecting an integrated circuit from electrostatic discharge. One aspect of the invention is a semiconductor device with protection circuitry which comprises an integrated circuit having at least one bond pad. A protection circuit is electrically connected to the bond pad and is operable to prevent damage to the integrated circuit during an electrostatic discharge event. The protection circuit comprises a first MOSFET having a first gate electrode connected in series with a second MOSFET having a second gate electrode wherein the first gate electrode and second gate electrode are commonly controlled in response to an electrostatic discharge event.