发明授权
US06537011B1 Method and apparatus for transferring and supporting a substrate 失效
用于转移和支撑衬底的方法和装置

Method and apparatus for transferring and supporting a substrate
摘要:
A method and apparatus for supporting and transferring a substrate in a semiconductor wafer processing system. In one aspect, a support ring having one or more substrate support members mounted thereon and defining a central opening therein for receipt of a substrate support member during processing is disclosed. In another aspect, a substrate handler blade having a plurality of substrate supports disposed thereon is provided which is adapted to support a substrate thereon and effectuate substrate transfer between the substrate handler blade and the support ring.
信息查询
0/0