发明授权
- 专利标题: Semiconductor substrate and method for making the same
- 专利标题(中): 半导体衬底及其制造方法
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申请号: US09562978申请日: 2000-04-27
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公开(公告)号: US06537513B1公开(公告)日: 2003-03-25
- 发明人: Hiroshi Amano , Tetsuya Takeuchi , Isamu Akasaki
- 申请人: Hiroshi Amano , Tetsuya Takeuchi , Isamu Akasaki
- 优先权: JP9-306215 19971107; WOUS98/23277 19981102
- 主分类号: C01B3326
- IPC分类号: C01B3326
摘要:
A substrate for fabricating semiconductor devices based on Group III semiconductors and the method for making the same. A substrate according to the present invention includes a base substrate, a first buffer layer, and a first single crystal layer. The first buffer layer includes a Group III material deposited on the base substrate at a temperature below that at which the Group III material crystallizes. The Group III material is crystallized by heating the buffer layer to a temperature above that at which the Group III material crystallizes to form a single crystal after the Group III material has been deposited. The first single crystal layer includes a Group III-V semiconducting material deposited on the first buffer layer at a temperature above that at which the Group III semiconducting material crystallizes. In one embodiment of the present invention, a second buffer layer and a second single crystal layer are deposited on the first single crystal layer. The second buffer layer includes a Group III material deposited on the first single crystal layer at a temperature below that at which the Group III material crystallizes. The Group III material is then crystallized by heating the buffer layer to a temperature above that at which the Group III material crystallizes to form a single crystal. The second single crystal layer includes a Group III-V semiconducting material deposited on the second buffer layer at a temperature above that at which the Group III semiconducting material crystallizes.
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