Invention Grant
- Patent Title: Electronic components mounting device and the mounting method
- Patent Title (中): 电子元件安装装置及安装方法
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Application No.: US09455459Application Date: 1999-12-06
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Publication No.: US06539622B2Publication Date: 2003-04-01
- Inventor: Wataru Hidese , Yusuke Yamamoto
- Applicant: Wataru Hidese , Yusuke Yamamoto
- Priority: JP10-346347 19981207
- Main IPC: H05K330
- IPC: H05K330

Abstract:
An electronic components mounting device has a plurality of feeder bases attached with tape feeders thereon, and a guide rail and a cylinder for drawing each of the feeder bases independently to a position for replenishing electronic components. When an electronic component runs out of the storage, only the feeder base that is carrying the relevant tape feeder gone out of the stock is drawn to a place for parts replenishment; in the mean time, the mounting actions keep on going by making use of tape feeders attached on other feeder base. Machine stop times can be decreased with the mounting device.
Public/Granted literature
- US20020124397A1 ELECTRONIC COMPONENTS MOUNTING DEVICE AND THE MOUNTING METHOD Public/Granted day:2002-09-12
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