公开(公告)号：US06802118B1

公开(公告)日：2004-10-12

申请号：US09586797

申请日：2000-06-05

申请人： Yun Hyung Yi

发明人： Yun Hyung Yi

IPC分类号： H05K330

CPC分类号： H05K13/046 ,  H05K13/0478 ,  Y10T29/49004 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/53178 ,  Y10T29/53191

摘要： A method of mounting electrical components on a printed circuit board includes moving the printed circuit board to a first mounting location, picking up a plurality of electrical components with a corresponding plurality of mounter heads, and then placing the electrical components onto the printed circuit board with the mounter heads. The mounter heads are arranged so that they can move with respect to each other in both the X and Y directions, which allows the mounting device to mount a plurality of electrical components onto the printed circuit board substantially simultaneously, thereby reducing the amount of time required to produce a finished PCB. In some embodiments of the invention, the printed circuit board may be moved from a first position at which a first mounting head mounts electrical components onto the printed circuit board to a second mounting position at which a second mounting head mounts electrical components on the printed circuit board. The first and second mounting positions may be located along the same conveyer, or on respective first and second conveyors, with the printed circuit board being moved back and forth between the conveyors.

摘要翻译： 将电气部件安装在印刷电路板上的方法包括将印刷电路板移动到第一安装位置，用对应的多个安装头拾取多个电气部件，然后将电气部件放置在印刷电路板上， 安装者头。 安装头被布置成使得它们可以在X和Y方向上相对于彼此移动，这允许安装装置基本上同时地将多个电气部件安装到印刷电路板上，从而减少所需的时间量 生产成品PCB。 在本发明的一些实施例中，印刷电路板可以从第一安装头将电气部件安装到印刷电路板上的第一位置移动到第二安装位置，在第二安装位置，第二安装头将电气部件安装在印刷电路 板。 第一和第二安装位置可以沿着相同的输送机或相应的第一和第二输送机定位，印刷电路板在输送机之间来回移动。

公开(公告)号：US06779253B2

公开(公告)日：2004-08-24

申请号：US09987662

申请日：2001-11-15

申请人： Dong June Kim

发明人： Dong June Kim

IPC分类号： H05K330

CPC分类号： H05K13/0404 ,  Y10S294/902 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183

摘要： A gripper having a grip tip for parts having different shapes is provided for a surface mount device. The gripper includes a piston installed inside of a through hole formed in a holder, and lifted or lowered by air flown in/out through the through hole, a moving unit connected to fixed blocks of the holder by a connection device configured to increase or decrease an interval according to the lifting or lowering operation of the piston, and multiple grip tips configured to support at least three points of a parts having a different shape.

摘要翻译： 为表面安装装置提供具有用于具有不同形状的部件的握持头的夹具。 夹持器包括安装在形成在保持器中的通孔内部的活塞，并且通过通孔流入/流出的空气被升高或降低;移动单元，其通过连接装置连接到固定块，该连接装置被配置为增加或减少 根据活塞的提升或降低操作的间隔，以及构造成支撑具有不同形状的部件的至少三个点的多个夹紧尖端。

公开(公告)号：US06757967B2

公开(公告)日：2004-07-06

申请号：US10119134

申请日：2002-04-09

申请人： Lisa J. Jimarez ,  Miguel A. Jimarez

发明人： Lisa J. Jimarez ,  Miguel A. Jimarez

IPC分类号： H05K330

CPC分类号： H01L23/16 ,  H01L23/36 ,  H01L23/50 ,  H01L25/0655 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/15311 ,  Y10S269/90 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49165 ,  Y10T29/49169 ,  Y10T29/49993 ,  Y10T29/53265

摘要： A chip mounting assembly is provided which includes a dielectric substrate having at least one integrated circuit (I/C) chip mounted thereon. An electrically conductive cover plate is in contact with all the chips with an electrically non-conducting thermally conducting adhesive. A stiffener member is provided which is mounted ante substrate and laterally spaced from the integrated circuit chip. At least one electrically conductive ground pad is formed an the substrate. The stiffener member has at least one through opening therein and electrically conductive adhesive extending through each opening and contacting the cover plate and each ground pad. The invention also provides a method of forming such an I/C chip assembly.

摘要翻译： 提供了一种芯片安装组件，其包括具有安装在其上的至少一个集成电路（I / C）芯片的电介质基板。 导电盖板与具有不导电导热粘合剂的所有芯片接触。 提供了一种加强构件，其被安装在前底座上并与集成电路芯片横向隔开。 至少一个导电接地焊盘形​​成为衬底。 加强件在其中具有至少一个通孔，并且导电粘合剂延伸穿过每个开口并接触盖板和每个接地垫。 本发明还提供了一种形成这种I / C芯片组件的方法。

公开(公告)号：US06735855B2

公开(公告)日：2004-05-18

申请号：US10121176

申请日：2002-04-11

申请人： Salman Akram ,  David R. Hembree ,  Warren M. Farnworth

发明人： Salman Akram ,  David R. Hembree ,  Warren M. Farnworth

IPC分类号： H05K330

CPC分类号： H01R13/2421 ,  G01R1/0466 ,  G01R1/0483 ,  H01L2924/0002 ,  H01R12/714 ,  H01R2201/20 ,  H05K7/1061 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/4914 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49174 ,  Y10T29/49204 ,  Y10T29/49222 ,  Y10T29/49224 ,  Y10T29/53174 ,  H01L2924/00

摘要： In a socket to test semiconductor die, a recessed socket contact that avoids pinching the die contacts is diclosed. The socket contacts allow for smaller socket holes and, allow denser contact spacing. A variety of embodiments are presented that are suitable for use depending on the spacing between the conducters. For more closely spaced conductors, the body of the socket contact comprises a head, a spring coupled to the head, and a shaft coupled to the spring. No outer shell is needed for the spring, as the nonconductive sides of the socket hole serve that function. For conductors spaced further apart, the body of the socket contact comprises a metal shaft having an aperture. Compression causes the shaft to close around the slit, thereby decreasing the amount of lateral buckling. For even more densly spaced contacts, semiconductor fabrication techniques are used to construct a dense array of contacts.

摘要翻译： 在用于测试半导体管芯的插座中，隐藏了避免挤压模具触头的凹入插座触点。 插座触点允许更小的插座孔，并允许更密集的接触间距。 呈现出根据导体之间的间距适合使用的各种实施例。 对于更紧密间隔的导体，插座触头的主体包括头部，联接到头部的弹簧和联接到弹簧的轴。 弹簧不需要外壳，因为插座孔的不导电侧面具有这种功能。 对于间隔更远的导体，插座触头的主体包括具有孔的金属轴。 压缩使轴在缝隙周围闭合，从而减少侧向屈曲的量。 对于更密集间隔的触点，使用半导体制造技术来构造密集的触点阵列。

公开(公告)号：US06732428B1

公开(公告)日：2004-05-11

申请号：US10192698

申请日：2002-07-11

申请人： Herman Kwong

发明人： Herman Kwong

IPC分类号： H05K330

CPC分类号： H05K1/183 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/16 ,  H01L2224/48472 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/0298 ,  H05K2201/10515 ,  H05K2201/10674 ,  H05K2201/10689 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/0401

摘要： A technique for increasing electronic component density on circuitry boards is disclosed. In one embodiment, the technique is realized as a method for increasing electronic component density on an electronic circuit board. The electronic circuit board has an electrically conductive signal layer formed on a dielectric layer, wherein the electrically conductive signal layer has a plurality of electrically conductive pads formed therein. The method comprises forming a cavity in the electronic circuit board extending through the electrically conductive signal layer and the dielectric layer. The cavity is sized to accommodate a first electronic component therein such that at least one first electrical connection may be formed between the first electronic component and a first portion of the plurality of electrically conductive pads, and at least one second electrical connection may be formed between a second electronic component, which is stacked over the first electronic component, and a second portion of the plurality of electrically conductive pads.

摘要翻译： 公开了一种用于在电路板上增加电子元件密度的技术。 在一个实施例中，该技术被实现为用于增加电子电路板上的电子元件密度的方法。 电子电路板具有形成在电介质层上的导电信号层，其中导电信号层具有形成在其中的多个导电焊盘。 该方法包括在电子电路板中形成延伸穿过导电信号层和电介质层的空腔。 空腔的尺寸适于容纳其中的第一电子部件，使得可以在第一电子部件和多个导电焊盘的第一部分之间形成至少一个第一电连接，并且可以在多个导电焊盘之间形成至少一个第二电连接 层叠在第一电子部件上的第二电子部件和多个导电焊盘的第二部分。

公开(公告)号：US06684495B2

公开(公告)日：2004-02-03

申请号：US09788808

申请日：2001-02-20

申请人： Yukiko Daido ,  Yoshihisa Hatta

发明人： Yukiko Daido ,  Yoshihisa Hatta

IPC分类号： H05K330

CPC分类号： H05K1/0271 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/34 ,  H05K3/3405 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/10446 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49165

摘要： A method of making a circuit board (10) on which surface electronic components (15) are mounted during the method using a solder reflow process. The board comprises a circuit portion (12), a surrounding circumferential portion (13) and at least one elongated opening (14) formed in the surrounding circumferential portion substantially parallel to the direction that the board travels during the reflow direction (16), thereby preventing electronic component soldering failures that may occur as a result of the deflection of the circuit board during the reflow process.

摘要翻译： 一种制造电路板（10）的方法，在该方法期间使用焊料回流工艺安装表面电子部件（15）。 电路板包括电路部分（12），周围圆周部分（13）和形成在围绕圆周部分的至少一个细长开口（14），基本上平行于电路板在回流方向（16）行进的方向，从而 防止在回流过程中由于电路板的偏转而可能发生的电子部件焊接故障。

公开(公告)号：US06684494B2

公开(公告)日：2004-02-03

申请号：US09967175

申请日：2001-09-28

申请人： Takeshi Ambe

发明人： Takeshi Ambe

IPC分类号： H05K330

CPC分类号： H05K13/0486 ,  H05K13/0409 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53191

摘要： An electronic parts replacing apparatus comprises: a holder for holding a piece of electronic parts to be replaced; a head detachably provided to the holder; and a guide bar for guiding the head to move close to or away from a circuit board. After holding the piece of electronic parts to be replaced on the circuit board by the holder and then integrating the head to the holder, the piece of electronic parts to be replaced are removed by moving the holder to a direction away from the circuit board. After removing the piece of electronic parts to be replaced from the holder and then holding a new piece of replacing electronic parts, the piece of replacing electronic parts are mounted on the circuit board by moving the head close to the circuit board.

摘要翻译： 电子部件更换装置包括：用于保持待更换的电子部件的保持器; 可拆卸地设置在保持器上的头部; 以及用于引导头部靠近或远离电路板移动的引导杆。 在通过保持器将电路板上要更换的电子部件保持在一起之后，然后将头部固定到保持器上时，通过将保持器移动到远离电路板的方向来移除待更换的电子部件。 在从保持器中取出待更换的电子部件，然后拿起新的更换电子部件之后，通过将电子头靠近电路板来将该更换电子部件安装在电路板上。

公开(公告)号：US06678947B1

公开(公告)日：2004-01-20

申请号：US09763460

申请日：2001-06-07

申请人： Petra Bauer ,  Reinhard Enders

发明人： Petra Bauer ,  Reinhard Enders

IPC分类号： H05K330

CPC分类号： H05K13/0409 ,  H05K13/085 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53178 ,  Y10T29/53183

摘要： Components are allocated to pipettes of different pipette types in accordance with an inverse greedy method or in accordance with a sequence of flow methods or a linear program as a result of which, for a given consecutive-ones characteristic of all the possible allocations, an optimun solution is ensured for a number of cycles, which can be predetermined, for the process of population a printed circuit board by means of an automatic placement machine.

摘要翻译： 根据逆贪心方法或根据流程方法或线性程序的顺序将组件分配给不同移液器类型的移液器，其结果是对于所有可能分配的给定连续特征，优化 确保了对于通过自动贴片机对印刷电路板进行种植的过程的多个周期的解决方案。

公开(公告)号：US06647615B2

公开(公告)日：2003-11-18

申请号：US09765669

申请日：2001-01-22

申请人： Satoshi Nonaka ,  Hiroaki Kurata

发明人： Satoshi Nonaka ,  Hiroaki Kurata

IPC分类号： H05K330

CPC分类号： H05K13/08 ,  Y10T29/4913 ,  Y10T29/53061 ,  Y10T29/53178 ,  Y10T29/53191

摘要： A parts mounting system includes a plurality of mounting units and a parts distributor unit for distributing parts to the mounting units. The parts distributor unit includes a specifying section for specifying types of parts that can be mounted by each of the mounting units, as division-specified parts, and a distributor section for sequentially distributing parts, based on the types of parts, from the parts other than the division-specified parts, to the mounting units. The distributor section sequentially distributes the division-specified parts to the mounting units so that the division-specified parts are divided thereby to reduce a difference in mounting time by each mounting unit after the parts other than division-specified parts are distributed.

摘要翻译： 零件安装系统包括多个安装单元和用于将零件分配到安装单元的零件分配器单元。 零件分配器单元包括指定部分，用于指定由每个安装单元可以安装的部件的类型作为分割指定部件，以及分配器部件，用于根据部件的类型从其他部件依次分配部件 比分割指定的部件，到安装单元。 分配器部分依次将分割指定的部件分配到安装单元，使得分割指定的部件被分割，从而在除了分配指定的部件之外的部件分布之后，减少每个安装单元的安装时间的差异。

公开(公告)号：US06643921B2

公开(公告)日：2003-11-11

申请号：US09873392

申请日：2001-06-05

申请人： Koichi Asai ,  Seigo Kodama ,  Shinsuke Suhara

发明人： Koichi Asai ,  Seigo Kodama ,  Shinsuke Suhara

IPC分类号： H05K330

CPC分类号： H05K13/08 ,  Y10T29/49004 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/53178 ,  Y10T29/53261

摘要： A system for mounting a plurality of circuit components on a circuit substrate, including a substrate supporting device which supports the circuit substrate, a component mounting device which mounts each of the circuit components on the circuit substrate supported by the substrate supporting device, a testing device which tests an actual state in which the each circuit component is mounted on the circuit substrate by the component mounting device, and a control device which controls the component mounting device to mount the each of the circuit components on the circuit substrate and controls the testing device to test, each time one of the circuit components is mounted on the circuit substrate by the component mounting device, an actual state in which the one circuit component is mounted on the circuit substrate.

摘要翻译： 一种用于将多个电路部件安装在电路基板上的系统，包括支撑电路基板的基板支撑装置，将由基板支撑装置支撑的电路基板上的每个电路部件安装的部件安装装置， 其通过部件安装装置测试每个电路部件安装在电路基板上的实际状态，以及控制装置，其控制部件安装装置将每个电路部件安装在电路基板上并控制测试装置 为了测试，每当通过部​​件安装装置将电路部件中的一个安装在电路基板上时，将一个电路部件安装在电路基板上的实际状态进行测试。