发明授权
US06541352B2 Semiconductor die with contoured bottom surface and method for making same
有权
具有成型底面的半导体模具及其制造方法
- 专利标题： Semiconductor die with contoured bottom surface and method for making same
- 专利标题（中）： 具有成型底面的半导体模具及其制造方法
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申请号： US09917524申请日： 2001-07-27
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公开(公告)号： US06541352B2公开(公告)日： 2003-04-01
- 发明人: Kurt P. Wachtler
- 申请人： Kurt P. Wachtler
- 主分类号： H01L2146
- IPC分类号： H01L2146
摘要：
Methods are disclosed for manufacturing semiconductor device dies and for removing material from the bottom side of the wafer dies, wherein a contoured surface is provided on the die bottom, such as through an etching process. In addition, methods are disclosed for securing a semiconductor device to a surface. Semiconductor wafers and die are also disclosed having contoured bottom surfaces.
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