发明授权
- 专利标题： Method for manufacture of electronic parts
- 专利标题（中）： 电子零件的制造方法
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申请号： US09587224申请日： 2000-06-02
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公开(公告)号： US06551763B1公开(公告)日： 2003-04-22
- 发明人: Anthony Paul Kitson , Peter Andrew Reath Bennett , Christopher David McCullough , Stuart Bayes , Kevin Barry Ray
- 申请人： Anthony Paul Kitson , Peter Andrew Reath Bennett , Christopher David McCullough , Stuart Bayes , Kevin Barry Ray
- 优先权： GB9821755 19981007
- 主分类号： G03F7039
- IPC分类号： G03F7039
摘要：
A composition used as a resist in the manufacture of electronic parts, for example printed circuits, and which is rendered soluble in a developer by pattemwise delivery of heat, comprises a polymer and optionally an infrared absorbing compound. However in contrast to conventional compositions no compound is present which alters the solubility of the polymer in an aqueous developer.
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