Method for manufacture of electronic parts
    4.
    发明授权
    Method for manufacture of electronic parts 有权
    电子零件的制造方法

    公开(公告)号:US06423456B1

    公开(公告)日:2002-07-23

    申请号:US09807084

    申请日:2001-04-09

    IPC分类号: G03F7039

    摘要: A composition used as a resist in the manufacture of electronic parts, for example printed circuits, and which is rendered soluble in a developer by patternwise delivery of heat, comprises a polymer of general formula (I), wherein R1 represents a hydrogen atom or alkyl group, R2 represents a hydrogen atom or alkyl group, R3 represents a hydrogen atom or alkyl group, and R4 represents hydroxyalkyl group, and wherein the ratio n/m is in the range 10/1 to 1/10.

    摘要翻译: 在电子部件例如印刷电路的制造中用作抗蚀剂的组合物通过图案方式传递热量而变得可溶于显影剂中的组合物包含通式(I)的聚合物,其中R 1表示氢原子或烷基 基团,R 2表示氢原子或烷基,R 3表示氢原子或烷基,R 4表示羟烷基,n / m比在10/1〜1/10的范围内。