- 专利标题: Wafer dicing blade consisting of multiple layers
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申请号: US09735465申请日: 2000-12-14
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公开(公告)号: US06561177B2公开(公告)日: 2003-05-13
- 发明人: Michael B. Ball
- 申请人: Michael B. Ball
- 主分类号: B28D104
- IPC分类号: B28D104
摘要:
The present invention provides a multi-layered diamond dicing blade. More particularly, the blade is a multi-layered dicing blade comprising an inner layer with a first set of diamond particles and an outer layer overlying the inner layer. The inner layer extends to the outermost periphery of the dicing blade. The outer layer comprises a second set of diamond particles having a size smaller than the first set of diamond particles.
公开/授权文献
- US20020077043A1 Wafer dicing blade consisting of multiple layers 公开/授权日:2002-06-20
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