• 专利标题: Wafer dicing blade consisting of multiple layers
  • 申请号: US09735465
    申请日: 2000-12-14
  • 公开(公告)号: US06561177B2
    公开(公告)日: 2003-05-13
  • 发明人: Michael B. Ball
  • 申请人: Michael B. Ball
  • 主分类号: B28D104
  • IPC分类号: B28D104
Wafer dicing blade consisting of multiple layers
摘要:
The present invention provides a multi-layered diamond dicing blade. More particularly, the blade is a multi-layered dicing blade comprising an inner layer with a first set of diamond particles and an outer layer overlying the inner layer. The inner layer extends to the outermost periphery of the dicing blade. The outer layer comprises a second set of diamond particles having a size smaller than the first set of diamond particles.
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