Invention Grant
- Patent Title: Fluid distribution system and process, and semiconductor fabrication facility utilizing same
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Application No.: US09874084Application Date: 2001-06-05
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Publication No.: US06561213B2Publication Date: 2003-05-13
- Inventor: Luping Wang , Terry A. Tabler , James A. Dietz
- Applicant: Luping Wang , Terry A. Tabler , James A. Dietz
- Main IPC: F17C1100
- IPC: F17C1100

Abstract:
A fluid distribution system for supplying a gas to a process facility such as a semiconductor manufacturing plant. The system includes a main fluid supply vessel coupled by flow circuitry to a local sorbent-containing supply vessel from which fluid, e.g., low pressure compressed gas, is dispensed to a fluid-consuming unit, e.g., a semiconductor manufacturing tool. A fluid pressure regulator is disposed in the flow circuitry or the main liquid supply vessel and ensures that the gas flowed to the fluid-consuming unit is at desired pressure. The system and associated method are particularly suited to the supply and utilization of liquefied compressed gases such as trimethylsilane, arsine, phosphine, and dichlorosilane.
Public/Granted literature
- US20020007849A1 Fluid distribution system and process, and semiconductor fabrication facility utilizing same Public/Granted day:2002-01-24
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