Invention Grant

  • Patent Title: Endoscope
  • Application No.: US09900339
    Application Date: 2001-07-06
  • Publication No.: US06565505B2
    Publication Date: 2003-05-20
  • Inventor: Kouta Ishibiki
  • Applicant: Kouta Ishibiki
  • Priority: JP2000-210193 20000711
  • Main IPC: A61B100
  • IPC: A61B100
Endoscope
Abstract:
An endoscope comprises a plurality of members constituting the endoscope, and parts-bonded sections each having at least members thereof bonded together using an adhesive. The temperatures of thermal destruction at which the adhesives included in the parts-bonded sections are thermally destroyed are made equal to or higher than the maximum temperature attained during a high-pressure steam sterilization process. At the same time, the temperatures of thermal destruction are made equal to or lower than the heat-resistance temperatures above which members bonded using the adhesives or members located near the bonded members included in the parts-bonded sections fail to resist heat.
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