Invention Grant
- Patent Title: Endoscope
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Application No.: US09900339Application Date: 2001-07-06
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Publication No.: US06565505B2Publication Date: 2003-05-20
- Inventor: Kouta Ishibiki
- Applicant: Kouta Ishibiki
- Priority: JP2000-210193 20000711
- Main IPC: A61B100
- IPC: A61B100

Abstract:
An endoscope comprises a plurality of members constituting the endoscope, and parts-bonded sections each having at least members thereof bonded together using an adhesive. The temperatures of thermal destruction at which the adhesives included in the parts-bonded sections are thermally destroyed are made equal to or higher than the maximum temperature attained during a high-pressure steam sterilization process. At the same time, the temperatures of thermal destruction are made equal to or lower than the heat-resistance temperatures above which members bonded using the adhesives or members located near the bonded members included in the parts-bonded sections fail to resist heat.
Public/Granted literature
- US20020010385A1 Endoscope Public/Granted day:2002-01-24
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