发明授权
US06566758B1 Current crowding reduction technique for flip chip package technology
有权
用于倒装芯片封装技术的当前拥挤减少技术
- 专利标题： Current crowding reduction technique for flip chip package technology
- 专利标题（中）： 用于倒装芯片封装技术的当前拥挤减少技术
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申请号： US09995168申请日： 2001-11-27
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公开(公告)号： US06566758B1公开(公告)日： 2003-05-20
- 发明人: Pradeep Trivedi , Tyler Thorp , Sudhakar Bobba , Dean Liu
- 申请人： Pradeep Trivedi , Tyler Thorp , Sudhakar Bobba , Dean Liu
- 主分类号： H01L2348
- IPC分类号： H01L2348
摘要：
A current crowding reduction technique involving the uniform displacement of vias around a bump is provided. By uniformly arranging vias around the bump on an integrated circuit, current can uniformly flow to and from the bump, effectively leading to reduced current density around the bump. Further, a method for reducing current crowding around a bump using an uniform arrangement of vias around the bump is provided.
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