发明授权
US06566761B1 Electronic device package with high speed signal interconnect between die pad and external substrate pad
有权
电子器件封装，在管芯焊盘和外部衬底焊盘之间具有高速信号互连
- 专利标题： Electronic device package with high speed signal interconnect between die pad and external substrate pad
- 专利标题（中）： 电子器件封装，在管芯焊盘和外部衬底焊盘之间具有高速信号互连
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申请号： US10138662申请日： 2002-05-03
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公开(公告)号： US06566761B1公开(公告)日： 2003-05-20
- 发明人: Laxminarayan Sharma , Siamak Fazelpour
- 申请人： Laxminarayan Sharma , Siamak Fazelpour
- 主分类号： H01L2940
- IPC分类号： H01L2940
摘要：
An electronic device package includes a modified ball grid array (“BGA”) interconnect substrate upon which a flip-chip device is mounted. The flip-chip device includes one or more high speed input/output solder bumps corresponding to input/output signals having data rates of up to 40 Gbps. A high speed solder bump is directly connected to an interconnect via formed within the BGA substrate, and the via is directly connected to a respective BGA solder ball positioned at an interior point of the BGA solder ball matrix. The BGA substrate is void of BGA solder balls between the designated high speed BGA solder ball and at least one edge of the substrate, thus providing a clear path to the designated high speed BGA solder ball for a high speed conductive trace formed on a printed circuit board.
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