A method and circuit module package for automated switch actuator insertion provides automated assembly of circuit modules having an integrated switch actuator, such as Secure Digital cards. A switch actuator is inserted automatically into a circuit module package housing by a robotic assembler. The housing and switch actuator have mating surfaces to retain the switch actuator within the housing so that shipping and subsequent assembly do not dislodge the switch actuator. The switch actuator/housing assembly can be contoured such that the switch actuator/housing assemblies may be stacked and then fed to a stack-loading feeder for joining of the actuator/housing assemblies to the remainder of the circuit module package housing. The switch actuator may be made from a material having a higher melting point than the housing so that ultrasonic welding may be performed on the circuit module package without joining the switch actuator permanently to the circuit module package assembly.