利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

7 条记录 (耗时 0.014 秒)

    Injection molded lens-barrel assembly and method for fabricating lens-barrel and mount assemblies
    3.
    发明授权
    Injection molded lens-barrel assembly and method for fabricating lens-barrel and mount assemblies 有权
    注塑镜头 - 镜筒组件和用于制造镜筒和安装组件的方法

    公开(公告)号：US06710945B1

    公开(公告)日：2004-03-23

    申请号：US10161963

    申请日：2002-06-03

    申请人： John Armando Miranda

    发明人： John Armando Miranda

    IPC分类号： G02B702

    CPC分类号： G02B7/021

    摘要： An injection molded lens-barrel assembly and method for fabricating lens-barrel and mount assemblies provides a low cost precision optical front end for digital cameras. A barrel is injection-molded around a lens, securing the lens in place. Alternatively, the lens-barrel assembly may be injection molded in one molding stage having two steps. A transparent material is injected to form a lens and an opaque compatible material is injected to form the barrel, yielding a single part that may be mounted to a digital camera. Multiple lens assemblies may be produced by incorporating an alignment feature on each lens to hold the lenses in an external mold fixture. One or more supporting structures are then molded around the multiple lenses, securing them in mechanical alignment.

    摘要翻译： 用于制造透镜镜筒和安装组件的注塑镜头镜筒组件和方法为数码相机提供了低成本精确的光学前端。 将镜筒注射成型，将镜片固定到位。 或者，透镜镜筒组件可以在具有两个步骤的一个模制阶段中注塑。 注入透明材料以形成透镜，并且注入不透明的相容材料以形成镜筒，产生可安装到数码相机的单个部件。 可以通过在每个透镜上并入对准特征以将透镜保持在外部模具夹具中来产生多个透镜组件。 然后在多个透镜周围模制一个或多个支撑结构，将它们固定在机械对准中。

    Personalized circuit module package and method for packaging circuit modules
    4.
    发明授权
    Personalized circuit module package and method for packaging circuit modules 有权
    个性化电路模块封装和封装电路模块的方法

    公开(公告)号：US06632997B2

    公开(公告)日：2003-10-14

    申请号：US09880277

    申请日：2001-06-13

    申请人： Paul Robert Hoffman ,  John Armando Miranda

    发明人： Paul Robert Hoffman ,  John Armando Miranda

    IPC分类号： H01L2328

    CPC分类号： H05K5/026

    摘要： A personalized circuit module package and method for packaging circuit modules provides graphical packaging for memory modules and other circuit modules. A removable housing is attached to a circuit module containing one or more integrated circuits bonded to a carrier and covered with an encapsulant. Graphics may be printed on the removable housing, or may be printed on an insert that is either inserted into a pocket within the removable housing, or is inserted between a removable housing having a window and the circuit module. Alternatively, the housing itself may be used to personalize the circuit module, by providing a colored or textured removable housing for the circuit module.

    摘要翻译： 用于封装电路模块的个性化电路模块封装和方法为存储器模块和其它电路模块提供图形封装。 可拆卸的外壳连接到电路模块，该电路模块包含一个或多个集成电路，该集成电路与载体结合并用密封剂覆盖。 图形可以印刷在可移除的外壳上，或者可以印刷在插入到可移除外壳中的凹槽中的插入件上，或者插入到具有窗口的可移除外壳和电路模块之间。 或者，壳体本身可以用于通过为电路模块提供彩色或纹理可移除的壳体来个性化电路模块。

    Method and circuit module package for automated switch actuator insertion
    5.
    发明授权
    Method and circuit module package for automated switch actuator insertion 有权

    公开(公告)号：US06570825B2

    公开(公告)日：2003-05-27

    申请号：US09934040

    申请日：2001-08-21

    申请人： John Armando Miranda ,  David Tapia Roman

    发明人： John Armando Miranda ,  David Tapia Roman

    IPC分类号： H05K700

    CPC分类号： G06K19/07732 ,  G06K19/077 ,  G11C5/00

    摘要： A method and circuit module package for automated switch actuator insertion provides automated assembly of circuit modules having an integrated switch actuator, such as Secure Digital cards. A switch actuator is inserted automatically into a circuit module package housing by a robotic assembler. The housing and switch actuator have mating surfaces to retain the switch actuator within the housing so that shipping and subsequent assembly do not dislodge the switch actuator. The switch actuator/housing assembly can be contoured such that the switch actuator/housing assemblies may be stacked and then fed to a stack-loading feeder for joining of the actuator/housing assemblies to the remainder of the circuit module package housing. The switch actuator may be made from a material having a higher melting point than the housing so that ultrasonic welding may be performed on the circuit module package without joining the switch actuator permanently to the circuit module package assembly.

    Circuit module having interconnects for connecting functioning and non-functioning add ons and method therefor
    6.
    发明授权
    Circuit module having interconnects for connecting functioning and non-functioning add ons and method therefor 有权
    具有用于连接功能和不起作用的附加物的互连的电路模块及其方法

    公开(公告)号：US07102891B1

    公开(公告)日：2006-09-05

    申请号：US10625290

    申请日：2003-07-23

    申请人： Jeffrey Alan Miks ,  John Armando Miranda

    发明人： Jeffrey Alan Miks ,  John Armando Miranda

    IPC分类号： H05K1/14

    CPC分类号： H05K1/142 ,  H05K3/325 ,  H05K2201/09163 ,  H05K2201/209 ,  H05K2203/167

    摘要： A multi use circuit module has a front half module. The front half module is a functional circuit module having electrical contacts on a front portion there of for electrically coupling the multi use circuit module to a host device. A rear half module is removably coupled to the front half module. The rear half module increases functionality of the multi use circuit module by allowing functional and non functional components to be coupled to the front half module.

    摘要翻译： 多用电路模块具有前半模块。 前半模块是功能电路模块，其具有在其前部上的电触点，用于将多用电路模块电耦合到主机设备。 后半模块可拆卸地联接到前半模块。 后半模块通过允许功能和非功能部件耦合到前半模块来增加多用途电路模块的功能。