Invention Grant
- Patent Title: Heat dissipating fin
- Patent Title (中): 散热片
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Application No.: US10178363Application Date: 2002-06-25
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Publication No.: US06571862B1Publication Date: 2003-06-03
- Inventor: Jack Wang , Cheng-Hua Cheng , Michael Lin , Charles Ma
- Applicant: Jack Wang , Cheng-Hua Cheng , Michael Lin , Charles Ma
- Main IPC: H05K720
- IPC: H05K720

Abstract:
A heat dissipation fin includes multiple unit each having a top, a first side and a second side and multiple bridges each connecting every two adjacent units together and connected to each one of the units at a fold. The bridge has a front side and a rear side and the top of the unit has a first side in parallel with the front side and a second side in parallel with the rear side of the bridge. Each front side has a width smaller than a width of each rear side and each first side has a width smaller than a width of each second side.
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