发明授权
- 专利标题： Bonding system
- 专利标题（中）： 粘接系统
-
申请号： US09899485申请日： 2001-07-05
-
公开(公告)号： US06572001B2公开(公告)日： 2003-06-03
- 发明人: Yam Mo Wong , Keng Yew Song
- 申请人： Yam Mo Wong , Keng Yew Song
- 主分类号： B23K3700
- IPC分类号： B23K3700
摘要：
A bonding system (1) bonds wires between a first electrical contact surface on a semiconductor chip and a second electrical contact surface on a substrate. The bonding system (1) has a first memory device (3) having a master bond program stored thereon and a second memory device (4) having an operating bond program stored thereon.
公开/授权文献
- US20030006266A1 Bonding system 公开/授权日：2003-01-09
信息查询
