公开(公告)号：US06750429B2

公开(公告)日：2004-06-15

申请号：US10054657

申请日：2002-01-22

申请人： Edwin Bogner ,  Michael A. Sammons ,  Ronald W. Colling

发明人： Edwin Bogner ,  Michael A. Sammons ,  Ronald W. Colling

IPC分类号： B23K3700

CPC分类号： B23K9/32 ,  B23K37/00

摘要： A drawer or other movable storage compartment disposed inside of a welding-type power supply for storing accessories used in welding, plasma cutting and induction heating applications is disclosed.

摘要翻译： 公开了一种设置在用于焊接，等离子切割和感应加热应用中的用于存储附件的焊接式电源内部的抽屉或其他可移动存储隔间。

公开(公告)号：US06739494B2

公开(公告)日：2004-05-25

申请号：US10455657

申请日：2003-06-05

申请人： Armin Felber

发明人： Armin Felber

IPC分类号： B23K3700

CPC分类号： H01L24/78 ,  B23K20/007 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A device with electrodes for the formation of a ball at the end of a wire protruding out of a capillary comprises a first electrode which has a tip and at least one further electrode. The first electrode and the at least one further electrode are electrically connected. The distance between the tip of the first electrode and the end of the wire is smaller than the distance between any point on the at least one further electrode and the end of the wire.

摘要翻译： 具有用于在从毛细管突出的导线的端部处形成球的电极的装置包括具有尖端和至少一个另外的电极的第一电极。 第一电极和至少一个另外的电极电连接。 第一电极的尖端和线的端部之间的距离小于至少一个另外的电极上的任何点与线的末端之间的距离。

公开(公告)号：US06715658B2

公开(公告)日：2004-04-06

申请号：US09907191

申请日：2001-07-17

申请人： Gil Perlberg ,  Ziv Atsmon ,  Benjamin Sonnenreich ,  Arie Bahalui

发明人： Gil Perlberg ,  Ziv Atsmon ,  Benjamin Sonnenreich ,  Arie Bahalui

IPC分类号： B23K3700

CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K2101/32 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/78301 ,  H01L2224/78302 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2224/48 ,  H01L2924/00

摘要： A bonding tool for bonding a fine wire to bonding pads having a very fine pitch is disclosed. The bonding tool comprises a working tip at an end thereof. The working tip includes i) a tapered section having a predetermined angle with respect to the longitudinal axis of the first cylindrical section, ii) a working face with a first annular chamfer formed at an outside portion of an end of the working tip and, iii) a second annular chamfer formed at an inside portion of the end of the working tip. The first and second annular chamfer adjacent one another and a substantially cylindrical axial passage coupled to an upper portion of the second annular chamfer. The bonding tool is formed from a material containing at least 80% ZrO2 by weight.

摘要翻译： 公开了一种用于将细线接合到具有非常细间距的接合焊盘的接合工具。 接合工具在其末端包括工作尖端。 所述工作尖端包括i）相对于所述第一圆柱形部分的纵向轴线具有预定角度的锥形部分，ii）形成在所述工作尖端的端部的外侧部分处的第一环形倒角的工作面，以及iii ）形成在所述加工尖端的端部的内部的第二环形倒角。 第一和第二环形倒角彼此相邻，并且基本上圆柱形的轴向通道联接到第二环形倒角的上部。 接合工具由含有至少80％ZrO 2重量的材料形成。

公开(公告)号：US06702173B2

公开(公告)日：2004-03-09

申请号：US10229775

申请日：2002-08-28

申请人： Takehiko Murakami

发明人： Takehiko Murakami

IPC分类号： B23K3700

CPC分类号： B41F19/068

摘要： When a movement of a film-like printing body is stopped for a longer time than the normal time because of generation of trouble or the like, heat of hot plates for full heating is prevented from being transmitted to the film-like printing body. All of the hot plates (3, 4, 5, 6, 7, 8) for preheating and full heating are moved downward, and a warp inhibiting body (27) is moved upward. Further, a shutter (34) for shutting off heat is inserted between the film-like printing body (2) and the full heating hot plates (6, 7). Further, at this time, a cold blast is blown to the shutter (34) for shutting off the heat.

摘要翻译： 当由于产生故障等而使膜状印刷体的运动停止比正常时间更长的时间时，防止加热板的热量被传送到膜状印刷体。 用于预热和全加热的所有热板（3,4,5,6,7,8）向下移动，并且翘曲抑制体（27）向上移动。 此外，在薄膜状印刷体（2）和全加热用热板（6,7）之间插入用于切断热量的挡板（34）。 此外，此时，将冷风吹送到快门（34）以关闭热量。

公开(公告)号：US06516991B2

公开(公告)日：2003-02-11

申请号：US09983200

申请日：2001-10-23

申请人： Akira Takeishi ,  Noriyuki Kubota

发明人： Akira Takeishi ,  Noriyuki Kubota

IPC分类号： B23K3700

CPC分类号： H01L24/85 ,  B23K20/004 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/78301 ,  H01L2224/78822 ,  H01L2224/85181 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/00014 ,  H01L2924/00

摘要： To remove the turbulence affecting the positioning control of a bonding head along the Z axis when a stage is moved in the XY direction, and to exercise accurate wire loop control, a feed forward compensator is provided for a control unit. The feed forward compensator calculates a reaction force, which is applied to a bonding head due to the acceleration generated during horizontal movement along the XY axes, based on the distance between the center of a rotary shaft and the center of gravity of the bonding arm, the mass of the bonding arm, and the acceleration generated when the XY stage is moved along the XY axes. The obtained reaction force is transmitted as a feed forward value to a controller, in order to offset the reaction force.

公开(公告)号：US06491203B2

公开(公告)日：2002-12-10

申请号：US09727002

申请日：2000-11-30

申请人： Yoshimitsu Terakado ,  Kazumasa Sasakura

发明人： Yoshimitsu Terakado ,  Kazumasa Sasakura

IPC分类号： B23K3700

CPC分类号： H01L24/78 ,  B23K20/004 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/78822 ,  H01L2224/85045 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01082 ,  H01L2224/48 ,  H01L2224/45099

摘要： A wire bonding apparatus equipped with a capillary through which a wire is passed, a torch electrode which is installed in a substantially horizontally movable manner so as to be positioned beneath the capillary, and a torch electrode driver which drives the torch electrode, in which the torch electrode is directly coupled to an output shaft of a pulse motor which is driven by a high-resolution angle control circuit, so that a resolution of the pulse motor obtained by the high-resolution angle control circuit is 30,000 parts per revolution or greater.

摘要翻译： 一种引线接合装置，其具有通过该导线穿过的毛细管，以大致水平移动的方式安装以便位于毛细管下方的炬电极和驱动该炬电极的炬电极驱动器，其中， 焊枪电极直接耦合到由高分辨率角度控制电路驱动的脉冲电机的输出轴上，使得由高分辨率角度控制电路获得的脉冲电动机的分辨率为30,000转/分钟以上。

公开(公告)号：US06439450B1

公开(公告)日：2002-08-27

申请号：US09940203

申请日：2001-08-27

申请人： Gregory M. Chapman ,  Michael J. Bettinger ,  Jennifer A. Due

发明人： Gregory M. Chapman ,  Michael J. Bettinger ,  Jennifer A. Due

IPC分类号： B23K3700

CPC分类号： H01L24/85 ,  B23K20/005 ,  B23K2101/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05624 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48824 ,  H01L2224/7825 ,  H01L2224/78301 ,  H01L2224/78302 ,  H01L2224/78306 ,  H01L2224/78307 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  Y10S228/904 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

摘要： An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.

公开(公告)号：US06325269B1

公开(公告)日：2001-12-04

申请号：US09582050

申请日：2000-08-16

申请人： Takesi Suzuki ,  Mamoru Sakurai ,  Minoru Torihata ,  Tatsunari Mii

发明人： Takesi Suzuki ,  Mamoru Sakurai ,  Minoru Torihata ,  Tatsunari Mii

IPC分类号： B23K3700

CPC分类号： H01L24/78 ,  B23K20/005 ,  H01L2224/45015 ,  H01L2224/78301 ,  H01L2224/78302 ,  H01L2224/786 ,  H01L2224/851 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2924/20753

摘要： A wire bonding capillary (1), which is able to decrease wire extraction resistance and suitable for a long and low loop wire bonding process, comprises a through bore (5) for feeding a bonding wire, a funnel-shaped bore (3) for guiding the wire to the through bore, and a tapered portion (11) formed at an exit of the through bore. The through bore length is between 0.2 and 1.5 times the through bore diameter. The tapered portion is tapered in two steps.

摘要翻译： 能够降低线材拔出阻力并且适用于长和低环线焊接工艺的引线接合毛细管（1）包括用于供给接合线的通孔（5），用于供给接合线的漏斗形孔（3），用于 将导线引导到通孔，以及形成在通孔的出口处的锥形部分（11）。 通孔长度为通孔直径的0.2至1.5倍。 锥形部分分两个阶段逐渐变细。

公开(公告)号：US06832714B2

公开(公告)日：2004-12-21

申请号：US10026135

申请日：2001-12-20

申请人： Jesse Pedigo ,  Timothy Meyer

发明人： Jesse Pedigo ,  Timothy Meyer

IPC分类号： B23K3700

CPC分类号： H05K3/1233 ,  H05K3/0094 ,  H05K3/4053 ,  H05K3/4069 ,  H05K2201/0959 ,  H05K2201/10204 ,  H05K2203/0126 ,  H05K2203/0139 ,  H05K2203/0156 ,  H05K2203/0182 ,  H05K2203/0554 ,  H05K2203/1105

摘要： A filling system includes a pressurized source of fill material and a pressure fill head wherein the fill head also includes a beating element positioned so as to transfer heat to fill material passing through the fill head. A method of filling holes using a fill material passing through a pressure fill head includes the steps of causing fill material to enter the fill head\, modifying the viscosity of the fill material while it is within the fill head, and causing the modified viscosity fill material to exit the fill head and enter at least one hole.

摘要翻译： 填充系统包括加压填充源和压力填充头，其中填充头还包括打浆元件，该打浆元件定位成传递热量以填充通过填充头的材料。 使用通过压力填充头的填充材料填充孔的方法包括以下步骤：使填充材料进入填充头\，在填充头内部改变填充材料的粘度，并且使修饰粘度填充 材料离开填充头并进入至少一个孔。

公开(公告)号：US06729527B2

公开(公告)日：2004-05-04

申请号：US09772421

申请日：2001-01-30

申请人： Benjamin Sonnenreich ,  Sigalit Robinzon

发明人： Benjamin Sonnenreich ,  Sigalit Robinzon

IPC分类号： B23K3700

CPC分类号： H01L24/78 ,  B23K20/004 ,  B23K2101/32 ,  H01L2224/78301 ,  H01L2224/78302 ,  H01L2224/78309 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01016 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2224/48 ,  H01L2224/45099

摘要： A bonding tool for bonding a wire to a substrate. The bonding tool has a body portion, a working tip coupled to one end of the body portion, an orifice extending along a longitudinal axis of the body and the working tip, and a polymer coating disposed over at least a portion of a surface of the orifice.

摘要翻译： 用于将导线接合到基板的接合工具。 接合工具具有主体部分，联接到主体部分的一端的工作尖端，沿着主体的纵向轴线延伸的小孔和工作尖端，以及聚合物涂层，其设置在该主体部分的表面的至少一部分上方 孔。