发明授权
US06573600B2 Multilayer wiring substrate having differential signal wires and a general signal wire in different planes
有权
具有差分信号线的多层布线基板和不同平面中的一般信号线
- 专利标题： Multilayer wiring substrate having differential signal wires and a general signal wire in different planes
- 专利标题（中）： 具有差分信号线的多层布线基板和不同平面中的一般信号线
-
申请号： US09817787申请日： 2001-03-27
-
公开(公告)号： US06573600B2公开(公告)日： 2003-06-03
- 发明人: Atsushi Kikuchi , Makoto Iijima , Yoshihiko Ikemoto , Muneharu Morioka , Yoshiyuki Kimura
- 申请人： Atsushi Kikuchi , Makoto Iijima , Yoshihiko Ikemoto , Muneharu Morioka , Yoshiyuki Kimura
- 优先权： JP2000-353497 20001120
- 主分类号： G01R1900
- IPC分类号： G01R1900
摘要：
A multilayer wiring substrate includes differential signal wires placed within a first insulating layer between a first power-supply plane and a first ground plane; and general signal wires placed within a second insulating layer between a second power-supply plane and a second ground plane. In the multilayer wiring substrate, the differential signal wires are placed in a different plane from a plane having each of the general signal wires so that the different plane includes a first area having the differential signal wires, and a second area having one of the second power-supply plane and the second ground plane. The general signal wires are placed in a vertical direction of the second area in a laminated state so that each of the general signal wires is placed between the second power-supply plane and the second ground plane.