发明授权
- 专利标题: Electronic apparatus having a printed circuit board with multi-point grounding
- 专利标题(中): 具有多点接地印刷电路板的电子设备
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申请号: US09804265申请日: 2001-03-13
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公开(公告)号: US06573804B2公开(公告)日: 2003-06-03
- 发明人: Seiji Hayashi
- 申请人: Seiji Hayashi
- 优先权: JP2000-069876 20000314; JP2000-069877 20000314
- 主分类号: H03H738
- IPC分类号: H03H738
摘要:
An electronic apparatus comprises a conductive device frame, a signal transmitting print wiring plate arranged on said conductive device frame, incorporating a digital clock circuit and having a ground conductive member, a signal receiving print wiring plate arranged on said conductive device frame, incorporating a digital clock circuit and having a ground conductive member, a cable including a signal wire and a ground wire for a signal transmission and electrically connecting said signal transmitting print wiring plate to said signal receiving print wiring plate on said conductive device frame and an impedance element electrically connecting an arbitrary single point on the ground conductive member of said signal receiving print wiring plate to said conductive device frame, wherein said impedance element has circuit parameters equivalent to impedance characteristics between said cable ground wire and said conductive device frame.
公开/授权文献
- US20010043197A1 Electronic apparatus 公开/授权日:2001-11-22
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