- 专利标题: Stacked intelligent power module package
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申请号: US09791629申请日: 2001-02-26
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公开(公告)号: US06574107B2公开(公告)日: 2003-06-03
- 发明人: O-seob Jeon , Gi-young Jeon , Seung-yong Choi , Seung-won Lim , Seung-jin Kim , Eul-bin Im , Byeong Gon Kim
- 申请人: O-seob Jeon , Gi-young Jeon , Seung-yong Choi , Seung-won Lim , Seung-jin Kim , Eul-bin Im , Byeong Gon Kim
- 优先权: KR2000-66825 20001110
- 主分类号: H05K720
- IPC分类号: H05K720
摘要:
A stacked intelligent power module package is provided. The intelligent power module package of the present invention includes a power unit including a heat sink and a control unit which is separately manufactured from the power unit and is subsequently stacked on the power unit. The power unit and the control unit of the intelligent power module package are stacked in two different ways including stacking two wire-bonded leadframes of the power unit and the control unit and stacking two separate semiconductor packages of the power unit and the control unit by using locking means formed in each of the semiconductor packages after a trimming/forming process and an electrical property test are finished.
公开/授权文献
- US20020057553A1 Stacked intelligent power module package 公开/授权日:2002-05-16