发明授权
- 专利标题: Resin sealing apparatus and resin sealing method
- 专利标题(中): 树脂密封装置和树脂密封方法
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申请号: US09740956申请日: 2000-12-21
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公开(公告)号: US06576178B2公开(公告)日: 2003-06-10
- 发明人: Hideki Mizuno , Kiyomitsu Ishimura
- 申请人: Hideki Mizuno , Kiyomitsu Ishimura
- 优先权: JP11-364148 19991222
- 主分类号: B29C4514
- IPC分类号: B29C4514
摘要:
An apparatus for sealing a resin uses a liquid resin. A substrate has a frame for surrounding the substrate and is provided with a plurality of semiconductor devices. The substrate has a first opening portion. A squeegee guide plate is placed on the frame and has a second opening portion. The second opening portion is larger than first opening portion in size. A first squeegee moves along the squeegee guide plate in a first direction and rakes the liquid resin. The liquid resin is protuberated in order to bury the semiconductor devices. A second squeegee moves along the squeegee guide plate in a second direction opposite to the first direction and further rakes the liquid resin so as to smooth a surface of the liquid resin. A turning mechanism serves to turn the second squeegee in a circular arc form during the movement of the second squeegee.
公开/授权文献
- US20010004923A1 Resin sealing apparatus and resin sealing method 公开/授权日:2001-06-28