发明授权
- 专利标题： Ultrasonic manufacturing apparatuses, multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards
- 专利标题（中）： 超声波制造装置，多层柔性布线板以及多层挠性布线板的制造方法
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申请号： US09642638申请日： 2000-08-22
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公开(公告)号： US06583364B1公开(公告)日： 2003-06-24
- 发明人: Hideyuki Kurita , Masanao Watanabe , Masayuki Nakamura , Mitsuhiro Fukuda , Hiroyuki Usui
- 申请人： Hideyuki Kurita , Masanao Watanabe , Masayuki Nakamura , Mitsuhiro Fukuda , Hiroyuki Usui
- 优先权： JP11-239358 19990826; JP11-246594 19990901; JP11-246963 19990901
- 主分类号： H05K100
- IPC分类号： H05K100
摘要：
The present invention pertains to a multilayer flexible wiring board. The multilayer flexible wiring board including first and second patterned wiring layers, a resin film interposed between a surface of the first wiring layer and a surface of the second wiring layer, and a bump connected to the surface of the second wiring layer, wherein the resin film is adapted to form an opening when the bump to force into the resin film and an ultrasonic wave is applied to the bump and the bump is left in the opening to electrically connect the top of the bump to the first wiring layer.
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