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    Board pieces, flexible wiring boards, and processes for manufacturing flexible wiring boards
    5.
    发明授权
    Board pieces, flexible wiring boards, and processes for manufacturing flexible wiring boards 有权
    板件，柔性布线板以及制造柔性布线板的工艺

    公开(公告)号：US06596947B1

    公开(公告)日：2003-07-22

    申请号：US09937590

    申请日：2002-01-18

    申请人： Hideyuki Kurita ,  Masanao Watanabe ,  Toshihiro Shinohara ,  Mitsuhiro Fukuda ,  Yukio Anzai

    发明人： Hideyuki Kurita ,  Masanao Watanabe ,  Toshihiro Shinohara ,  Mitsuhiro Fukuda ,  Yukio Anzai

    IPC分类号： H05K103

    CPC分类号： H05K3/363 ,  H05K1/036 ,  H05K1/0393 ,  H05K3/28 ,  H05K3/284 ,  H05K3/305 ,  H05K3/3457 ,  H05K3/3473 ,  H05K3/3494 ,  H05K2201/0129 ,  H05K2201/10977 ,  H05K2203/0195 ,  H05K2203/0285 ,  H05K2203/065 ,  Y10T428/2804

    摘要： A board piece 2 of the present invention comprises a non-thermoplastic resin film 11, a thermoplastic resin film 10 formed on the non-thermoplastic resin film 11 and a metal wiring 8 formed on the surface of the thermoplastic resin film 10. Metal wiring 8 is partially exposed on board piece 2 to form a contact 12. A low-melting metal coating 13 is formed on contact 12 and two board pieces 2a, 2b are pressed against each other under heating with contacts 12a, 12b thereof being in contact with each other so that thermoplastic resin films 10a, 10b soften to adhere board pieces 2a, 2b to each other and low-melting metal coatings 13a, 13b melt and then solidify to connect contacts 12a, 12b to each other. The region of metal wiring 8 not used for connection is wiring 17 connecting contacts 12 to each other and a cover film 19 can be provided on the surface thereof. Contacts 12a, 12b can also be connected by applying ultrasonic wave.

    摘要翻译： 本发明的板片2包括非热塑性树脂膜11，形成在非热塑性树脂膜11上的热塑性树脂膜10和形成在热塑性树脂膜10的表面上的金属布线8.金属布线8 被部分地暴露在板件2上以形成触点12.在触点12上形成低熔点金属涂层13，并且两个板片2a，2b在加热时被彼此挤压，其触点12a，12b与每个 使得热塑性树脂膜10a，10b软化以将板片2a，2b彼此粘合并且熔融金属涂层13a，13b熔化然后固化以将触点12a，12b彼此连接。 不用于连接的金属布线8的区域是将触点12彼此连接的布线17，并且可以在其表面上设置覆盖膜19。 触点12a，12b也可以通过施加超声波来连接。

    Flexible board made by joining two pieces through an adhesive film
    7.
    发明授权
    Flexible board made by joining two pieces through an adhesive film 有权
    通过粘合膜连接两片制成的柔性板

    公开(公告)号：US06437251B1

    公开(公告)日：2002-08-20

    申请号：US09505871

    申请日：2000-02-17

    申请人： Hideyuki Kurita ,  Masanao Watanabe ,  Toshihiro Shinohara ,  Yukio Anzai ,  Mitsuhiro Fukuda

    发明人： Hideyuki Kurita ,  Masanao Watanabe ,  Toshihiro Shinohara ,  Yukio Anzai ,  Mitsuhiro Fukuda

    IPC分类号： H05K100

    CPC分类号： H05K3/363 ,  H05K1/036 ,  H05K3/305 ,  H05K3/328 ,  H05K3/3473 ,  H05K3/361 ,  H05K2201/0129 ,  H05K2201/10977 ,  H05K2203/0285 ,  H05K2203/065 ,  H05K2203/1189

    摘要： This invention provides a specially-shaped, double-face flexible printed wiring board having a small pitch at a high production yield. Metal wirings 22 and 32 formed on a base film 21, 31 of two elemental pieces 20 and 30 of a flexible printed wiring board are arranged in such a manner as to face each other while sandwiching a bonding film 16 not containing conductive particles between them, and are heat-pressed to each other. The adhesive resin film 16 so softened is pushed aside from the metal wirings 22 and 32 and the low melting point metal coating films 23 and 33 formed on the surface of the metal wirings 22 and 32 come into direct contact with each other and are fused. In this instance, the softened adhesive resin film 16 is charged between the metal wirings 22 and 32. Therefore, the molten low melting point metal does not scatter. The base films 21 and 31 are bonded by the adhesive resin film 16.

    摘要翻译： 本发明提供一种以高产量产生具有小间距的特殊形状的双面柔性印刷线路板。 在柔性印刷电路板的两个元件20和30的基膜21,31上形成的金属布线22和32以彼此面对的方式布置，同时夹着不含导电颗粒的接合膜16， 并彼此热压。 被软化的粘合树脂膜16被从金属布线22和32推开，并且形成在金属布线22和32的表面上的低熔点金属涂覆膜23和33彼此直接接触并被熔合。 在这种情况下，软化的粘合树脂膜16被填充在金属布线22和32之间。因此，熔融的低熔点金属不会散射。 基膜21和31通过粘合树脂膜16粘接。

    Processes for manufacturing flexible wiring boards and the resulting flexible wiring boards
    8.
    发明授权
    Processes for manufacturing flexible wiring boards and the resulting flexible wiring boards 失效
    用于制造柔性布线板和由此产生的柔性布线板的工艺

    公开(公告)号：US06729022B2

    公开(公告)日：2004-05-04

    申请号：US10230329

    申请日：2002-08-29

    申请人： Hideyuki Kurita ,  Masanao Watanabe

    发明人： Hideyuki Kurita ,  Masanao Watanabe

    IPC分类号： H05K310

    CPC分类号： H05K3/4635 ,  H05K1/0393 ,  H05K3/005 ,  H05K3/28 ,  H05K3/423 ,  H05K3/4617 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/09563 ,  H05K2203/0195 ,  H05K2203/0285 ,  H05K2203/1189 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155

    摘要： The present invention aims to connect metal films without forming any opening in a resin film. Against a first resin film 16 formed on a first metal film 12 are pressed bumps 21 on a second metal film 11 so that the bumps 21 are embedded into the first resin film 16. Either one of the first metal film 12 or the second metal film 11 or both is (are) patterned while the bumps 21 are in contact with the first metal film 12, and the first resin film 16 is heat-treated while the top of the first resin film is partially exposed to discharge the solvent or moisture from the exposed zone and cure the first resin film 16. After curing, the bumps 21 and the first metal film 12 may be ultrasonically bonded to each other. A second resin film and a third metal film may be further layered to form a multilayer structure.

    摘要翻译： 本发明的目的是在不在树脂膜中形成任何开口的情况下连接金属膜。在第一金属膜12上形成的第一树脂膜16上，在第二金属膜11上形成按压凸块21，使得凸块21嵌入到第一金属膜11中。 在第一金属膜12或第二金属膜11中的任一个或两者均被图案化，同时凸块21与第一金属膜12接触，并且第一树脂膜16被热处理同时 第一树脂膜的顶部部分地暴露以从暴露区域排出溶剂或水分，并使第一树脂膜16固化。固化后，凸块21和第一金属膜12可以彼此超声波接合。 可以进一步层叠第二树脂膜和第三金属膜以形成多层结构。

    Method for manufacturing double-sided flexible printed board
    10.
    发明授权
    Method for manufacturing double-sided flexible printed board 失效
    双面柔性印刷电路板的制造方法

    公开(公告)号：US06705007B1

    公开(公告)日：2004-03-16

    申请号：US09459895

    申请日：1999-12-14

    申请人： Hideyuki Kurita ,  Masanao Watanabe

    发明人： Hideyuki Kurita ,  Masanao Watanabe

    IPC分类号： H01K310

    CPC分类号： H05K3/38 ,  H05K1/0346 ,  H05K3/0011 ,  H05K3/06 ,  H05K2201/0154 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/31681 ,  Y10T428/31721

    摘要： A double-sided flexible printed circuit board is manufactured by the following steps of: (a) forming a polyimide precursor layer on a first metal layer; (b) forming a second metal layer on the polyimide precursor layer; (c) patterning the second metal layer to form a second circuit layer or (c′) patterning the first metal layer to form a first circuit layer; and (d) imidating the polyimide precursor layer to form a polyimide insulating layer. The polyimide precursor layer is obtained by dissolving a polyamic acid or other polyimide precursor in N-methyl-2-pyrrolidone or the like and applying the resultant varnish to the first metal layer. The polyimide layer is then dried. The imidation ratio of the dried polyimide precursor layer is prevented from exceeding 50%.

    摘要翻译： 通过以下步骤制造双面柔性印刷电路板：（a）在第一金属层上形成聚酰亚胺前体层; （b）在所述聚酰亚胺前体层上形成第二金属层; （c）图案化第二金属层以形成第二电路层，或（c'）图案化第一金属层以形成第一电路层; 和（d）酰亚胺化聚酰亚胺前体层以形成聚酰亚胺绝缘层。 聚酰亚胺前体层通过将聚酰胺酸或其它聚酰亚胺前体溶解在N-甲基-2-吡咯烷酮等中并将所得清漆施加到第一金属层而获得。 然后干燥聚酰亚胺层。 干燥的聚酰亚胺前体层的酰亚胺化率可以防止超过50％。