发明授权
US06585150B1 Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder
失效
倒装芯片器件的焊接保护涂层和无焊接接合在具有电镀焊料的层压板上
- 专利标题： Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder
- 专利标题（中）： 倒装芯片器件的焊接保护涂层和无焊接接合在具有电镀焊料的层压板上
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申请号： US09687524申请日： 2000-10-12
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公开(公告)号： US06585150B1公开(公告)日： 2003-07-01
- 发明人: William E. Bernier , Donald W. Henderson , James Spalik , Isabelle Paquin
- 申请人： William E. Bernier , Donald W. Henderson , James Spalik , Isabelle Paquin
- 主分类号： B23K3102
- IPC分类号： B23K3102
摘要：
A method for protecting tin oxide coated solder surfaces against further oxidation and a method for fluxless solder joining of such surfaces is provided.
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