公开(公告)号：US06830177B2

公开(公告)日：2004-12-14

申请号：US10238118

申请日：2002-09-10

申请人： Deepak K. Pai

发明人： Deepak K. Pai

IPC分类号： B23K3102

CPC分类号： H01L23/49827 ,  H01L2224/16 ,  H05K3/3421 ,  H05K3/3484 ,  H05K2201/10424 ,  H05K2201/10704 ,  H05K2201/10719 ,  Y02P70/613

摘要： The present invention comprises cost-effectively manufactured, electrically conductive and mechanically compliant micro-leads and a method of utilizing these compliant micro-leads to interconnect area grid array chip scale packages (“CSPs”) to printed wiring boards (“PWBs”). The preferred method includes orienting a plurality of conductive compliant micro-leads, secured to one another in parallel with tie bars and tooling, to align with a corresponding pattern of conductive pads located along the surface of an area grid array CSP. The compliant micro-leads are electrically connected and mechanically secured to the corresponding connecting surfaces of the area grid array CSP. Next, the securing tie bars and the tooling are removed. The opposite ends of the conductive compliant micro-leads are then oriented to align with a corresponding pattern of conductive surface pads on a PWB. The opposite end of each compliant micro-lead is then electrically connected and mechanically secured to its corresponding connecting pad located on the surface of the PWB, thereby establishing a compliant electrical connection between the area grid array CSP and the PWB. An alternative embodiment of the present invention utilizes an area grid array interposer with compliant micro-leads to provide additional compliancy.

摘要翻译： 本发明包括成本有效的制造，导电和机械兼容的微引线以及利用这些柔性微引线将区域格栅阵列芯片级封装（“CSP”）互连到印刷电路板（“PWB”）的方法。 优选的方法包括使多个导电柔性微引线定向成与导杆和工具平行地彼此固定，以与沿着区域栅格阵列CSP的表面定位的导电焊盘的对应图案对准。 柔性微引线电连接并机械固定到区域网格阵列CSP的对应连接表面。 接下来，拆下固定连接杆和工具。 然后将导电顺应性微引线的相对端定向成与P​​WB上的导电表面焊盘的相应图案对准。 然后，每个柔性微引线的相对端电连接并机械固定到位于PWB表面上的相应的连接焊盘，从而在区域栅格阵列CSP和PWB之间建立顺从的电连接。 本发明的替代实施例利用具有柔性微引线的区域栅格阵列插入器来提供额外的符合性。

公开(公告)号：US06811074B2

公开(公告)日：2004-11-02

申请号：US10377204

申请日：2003-02-27

申请人： Guido Suter ,  Christoph Tschudin

发明人： Guido Suter ,  Christoph Tschudin

IPC分类号： B23K3102

CPC分类号： H01L24/78 ,  B23K1/0016 ,  B23K1/012 ,  B23K3/063 ,  B23K2101/40 ,  H01L2224/78301 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2224/48 ,  H01L2224/45099

摘要： For dispensing solder on a substrate, a soldering wire and a forming gas heated to a predetermined temperature are fed to a mixing chamber of a two-component nozzle so that, in the mixing chamber, solder is melted off and carried with the gas stream. The solder blown out of the two-component nozzle settles on the substrate. The two-component nozzle is moved or swivelled relative to the substrate in order to distribute the solder over a predetermined area of the substrate.

摘要翻译： 为了在基板上分配焊料，将加热到预定温度的焊丝和成形气体供给到双组分喷嘴的混合室，使得在混合室中，焊料熔化并携带气流。 从双组分喷嘴吹出的焊料沉积在基板上。 双组分喷嘴相对于基底移动或旋转，以便将焊​​料分布在衬底的预定区域上。

公开(公告)号：US06805276B2

公开(公告)日：2004-10-19

申请号：US10143558

申请日：2002-05-10

申请人： Kazumi Wada

发明人： Kazumi Wada

IPC分类号： B23K3102

CPC分类号： E01B29/42 ,  B23K23/00 ,  Y10T428/12493

摘要： To prevent decreases in fatigue strength of a base material by relieving the residual stress of a weld. A method for welding a deposit metal to a base material with reduced residual stress, comprising a step of welding a deposit metal to a base material; and a step of plastically deforming into a recess, an area on the surface of the base material around a peripheral portion of the deposit metal. The invention is also directed to a welded block joint between a wire and a base material, characterized by comprising a deposit metal receiving an end portion of the wire and welded to the base material, wherein an area which is plastically deformed into a recess is formed on the base material surface at a peripheral portion of the deposit metal.

摘要翻译： 通过减轻焊接的残余应力来防止基材的疲劳强度降低。 一种用于将沉积金属焊接到具有降低的残余应力的基底材料的方法，包括将沉积金属焊接到基底材料的步骤; 以及将金属表面周围的基材表面的区域塑性变形为凹陷的步骤。 本发明还涉及一种电线和基材之间的焊接块接头，其特征在于，包括一个沉积金属，其接收该电线的端部并焊接到该基底材料上，其中形成塑性变形成凹槽的区域 在沉积金属的周边部分的基材表面上。

公开(公告)号：US06796481B2

公开(公告)日：2004-09-28

申请号：US10169982

申请日：2002-07-12

申请人： Akira Yamauchi

发明人： Akira Yamauchi

IPC分类号： B23K3102

CPC分类号： H01L21/563 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method for mounting a chip on a substrate includes applying the underfill agent onto at least one of the substrate and the chip and moving the chip to the substrate to bring the bump into contact with the electrode. The method also includes steps to distribute the underfill agent in a space between the chip and the substrate, to around the bump and the electrode, heating the bump or electrode in the state that the bump is buried in the underfill agent to melt the bump or electrode so as to weld the bump to the electrode.

摘要翻译： 将芯片安装在基板上的方法包括将底部填充剂施加到至少一个基板和芯片上并将芯片移动到基板以使凸块与电极接触。 该方法还包括以下步骤：将底部填充剂分散在芯片和衬底之间的空间中，到凸块和电极周围，在突起被埋在底部填充剂中的状态下加热凸块或电极以熔化凸块或 电极，以便将凸块焊接到电极。

公开(公告)号：US06793119B2

公开(公告)日：2004-09-21

申请号：US10228259

申请日：2002-08-27

申请人： Joseph Maria Gerardus Eijkenboom ,  Jozef Hubert Meessen ,  Hendrikus Catharina Guillaume Maria Schrijen

发明人： Joseph Maria Gerardus Eijkenboom ,  Jozef Hubert Meessen ,  Hendrikus Catharina Guillaume Maria Schrijen

IPC分类号： B23K3102

CPC分类号： C22C38/44 ,  B23K35/3086 ,  B23K35/383 ,  B23K2101/10 ,  B23K2103/05 ,  C22C38/58

摘要： Process for welding duplex steel in the presence of a shielding gas without use being made of welding aids and with nitrogen being added to the shielding gas and with an austenitic-ferritic duplex steel with a chromium content of between 28 and 35 wt. % and a nickel content of between 3 and 10 wt. % being used.

摘要翻译： 在保护气体存在下不使用焊接辅助材料并且将氮气加入到保护气体中以及铬含量为28至35重量％的奥氏体 - 铁素体双相钢的方法。 ％和镍含量在3和10重量％之间。 ％ 正在使用。

公开(公告)号：US06769595B2

公开(公告)日：2004-08-03

申请号：US10025402

申请日：2001-12-19

申请人： Israel Stol ,  Wayne M. Thomas ,  Philip L. Threadgill

发明人： Israel Stol ,  Wayne M. Thomas ,  Philip L. Threadgill

IPC分类号： B23K3102

CPC分类号： B21J15/027 ,  B23K20/12 ,  B23K20/127 ,  B23K20/129 ,  B23K20/1295

摘要： A method of joining a pair of metal components with a rivet having a hardness that is substantially similar to at least one of the metal components. The metal components are stack upon each other and the rivet is rotated and simultaneously plunged in the metal components under pressure to friction weld and metallurgically bond the rivet to the metal components.

摘要翻译： 一种用一种具有与至少一种金属组分相似的硬度的铆钉来接合一对金属部件的方法。 金属部件彼此堆叠并且铆钉被旋转并同时在压力下插入金属部件以进行摩擦焊接并且将铆钉冶金结合到金属部件。

公开(公告)号：US06766938B2

公开(公告)日：2004-07-27

申请号：US10042829

申请日：2002-01-08

申请人： Chi Wah Cheng ,  Ping Chun Chong ,  Chi Fung Chan ,  Chin Pang Chan

发明人： Chi Wah Cheng ,  Ping Chun Chong ,  Chi Fung Chan ,  Chin Pang Chan

IPC分类号： B23K3102

CPC分类号： B23K3/0623 ,  B23K35/0244 ,  B23K2101/42 ,  H01L21/4853 ,  H05K3/3478

摘要： The invention provides an apparatus and method for positioning solder balls in a desired array on a substrate. A positioning means is provided for positioning the solder balls in positions corresponding to the array of positions the solder balls are to take up on the substrate. A container for receiving a plurality of solder balls and which is movable between a first position remote from the positioning means and a second position directly thereover supplies solder balls to the positioning means. Means are provided to bias the solder balls in the direction of movement of the container from the first to the second position whereby to reduce or obviate damage to the solder balls during such movement.

摘要翻译： 本发明提供了一种用于将焊球定位在基板上的所需阵列的装置和方法。 提供了一种定位装置，用于将焊球定位在与焊球要吸附在衬底上的位置阵列相对应的位置。 一种用于接收多个焊球并且可以在远离定位装置的第一位置和直接在其之间的第二位置移动的容器将焊球提供给定位装置。 提供装置以使焊球从容器的第一位置移动到第二位置，从而减少或消除在这种运动期间对焊球的损坏。

公开(公告)号：US06742700B2

公开(公告)日：2004-06-01

申请号：US10083374

申请日：2002-02-27

申请人： Takuma Makino ,  Masayuki Shinkai

发明人： Takuma Makino ,  Masayuki Shinkai

IPC分类号： B23K3102

CPC分类号： B23K35/001 ,  B23K35/0244

摘要： A composite material is produced by a method where an adhesive composition which comprises a particulate material that reduces thermal stress and a brazing material containing a noble metal element as a base, wherein the adhesive composition can bond two or more kinds of different members to form a composite member with sufficient bond strength to avoid causing damages, such as cracks that occur on the side of the member that is weak against thermal stress, and also by a method to produce a composite member comprised of two or more kinds of different members, in which either the adhesive composition is used or the bonding portion of the different members is filled with the particulate material that reduces thermal stress, and then a molten brazing material is poured there into, and cooled to bond the members.

摘要翻译： 复合材料通过以下方法制造：粘合剂组合物，其包含降低热应力的颗粒材料和含有贵金属元素作为基材的钎焊材料，其中粘合剂组合物可以粘合两种或更多种不同的构件以形成 复合构件，其具有足够的粘合强度，以避免造成损坏，例如在构件的在热应力方面较弱的侧面发生的裂纹，以及通过制造由两种或更多种不同构件组成的复合构件的方法， 使用粘合剂组合物或不同构件的粘合部分填充有降低热应力的颗粒材料，然后将熔融的钎焊材料浇注到其中，并冷却以使构件结合。

公开(公告)号：US06732907B2

公开(公告)日：2004-05-11

申请号：US10090142

申请日：2002-03-05

申请人： Ikuya Miyazawa

发明人： Ikuya Miyazawa

IPC分类号： B23K3102

CPC分类号： H05K3/3415 ,  B23K1/008 ,  B23K1/08 ,  B23K1/085 ,  B23K2101/40 ,  B23K2101/42 ,  H05K3/3447 ,  H05K3/3463 ,  H05K3/3468 ,  H05K3/3494 ,  H05K2203/081 ,  H05K2203/111 ,  H05K2203/1572 ,  H05K2203/1581 ,  Y02P70/613

摘要： A soldering method including: bonding a first electronic component having electrodes plated with a material containing lead to one surface of an interconnect substrate through solder containing no lead; and flow-soldering to bond a second electronic component to the other surface of the interconnect substrate. In the soldering method, a joint section between the first electronic component and the interconnect substrate is heated at the same time as or after the step of flow soldering to melt the joint section.

摘要翻译： 一种焊接方法，包括：通过不含铅的焊料，将具有镀有含有铅的材料的电极的第一电子部件接合到互连基板的一个表面; 并且流动焊接以将第二电子部件结合到互连基板的另一表面。 在焊接方法中，第一电子部件和互连基板之间的接合部在流动焊接的步骤的同时或之后被加热，以熔化接合部。

公开(公告)号：US06732905B2

公开(公告)日：2004-05-11

申请号：US10124174

申请日：2002-04-16

申请人： Giles Humpston ,  Yoshikatsu Ichimura ,  Nancy M. Mar ,  Daniel J. Miller ,  Michael J. Nystrom ,  Gary R. Trott

发明人： Giles Humpston ,  Yoshikatsu Ichimura ,  Nancy M. Mar ,  Daniel J. Miller ,  Michael J. Nystrom ,  Gary R. Trott

IPC分类号： B23K3102

CPC分类号： B23K1/008 ,  B23K1/00

摘要： Fluxless soldering processes use pressure variations and vented cavities within large-area solder joints to reduce void volumes and improve the properties of the large-area solder joints. The vents can be sealed after soldering if closed cavities are desired. A cavity can also improve hermeticity of a solder joint by providing an additional solder fillet around the cavity in addition to the solder fillet around the perimeter of the solder joint.

摘要翻译： 无焊接焊接工艺在大面积焊接点内使用压力变化和通风腔，以减少空隙体积并改善大面积焊点的性能。 如果需要闭合孔，通风口可以在焊接后进行密封。 除了围绕焊点的周边的焊料圆角之外，还通过在空腔周围提供附加的焊锡圆角，还可以改善焊接接头的气密性。