发明授权
- 专利标题: Adhesive tape and substrate for adhesive tape
- 专利标题(中): 胶带和胶带基材
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申请号: US09791921申请日: 2001-02-22
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公开(公告)号: US06586090B2公开(公告)日: 2003-07-01
- 发明人: Yoshio Nakagawa , Shigeki Ishiguro , Masayoshi Natsume , Shinichi Takada , Kooki Ooyama
- 申请人: Yoshio Nakagawa , Shigeki Ishiguro , Masayoshi Natsume , Shinichi Takada , Kooki Ooyama
- 优先权: JP2000-047332 20000224; JP2000-288673 20000922
- 主分类号: B32B2732
- IPC分类号: B32B2732
摘要:
The present invention provides an adhesive tape comprising a substrate and an adhesive layer formed on at least one side of the substrate, wherein the substrate comprises the following Component A, Component B and Component C: Component A: a thermoplastic resin having a carbonyl oxygen atom in the molecular skeleton Component B: a polymer alloy containing an ethylene component and a propylene component Component C: an inorganic metal compound surface-treated with a silane coupling agent but substantially no halogen atom. The adhesive tape and the substrate for the adhesive tape of the present invention are free of generation of dioxin or a toxic gas upon incineration, are superior in flexibility, resistance to thermal deformation, flame resistance and resistance to surface whitening, and show suitable stretchability and mechanical strength.
公开/授权文献
- US20010031355A1 Adhesive tape and substrate for adhesive tape 公开/授权日:2001-10-18