发明授权
- 专利标题： Use of endpoint system to match individual processing stations within a tool
- 专利标题（中）： 使用端点系统来匹配工具中的各个处理站
-
申请号： US09753705申请日： 2001-01-03
-
公开(公告)号： US06588007B1公开(公告)日： 2003-07-01
- 发明人: Alexander J. Pasadyn , Joyce S. Oey Hewett
- 申请人： Alexander J. Pasadyn , Joyce S. Oey Hewett
- 主分类号： G06F1750
- IPC分类号： G06F1750
摘要：
A technique for processing a wafer in a semiconductor manufacturing process are disclosed. The method comprises first collecting a set of processing rate data from a multi-station processing tool, the set including process rate data from at least two stations in the processing tool. The collected processing rate data is then communicated to a controller that autonomously compares the processing rate data to determine whether to adjust a process parameter. The method then adjusts the process parameter for at least one station to match the process endpoint for the at least one station.