发明授权
US06589858B1 Method of making metal gate stack with etch endpoint tracer layer
有权
用蚀刻终点示踪层制作金属栅极叠层的方法
- 专利标题: Method of making metal gate stack with etch endpoint tracer layer
- 专利标题(中): 用蚀刻终点示踪层制作金属栅极叠层的方法
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申请号: US10163534申请日: 2002-06-07
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公开(公告)号: US06589858B1公开(公告)日: 2003-07-08
- 发明人: Srikanteswara Dakshina-Murthy , Paul R. Besser
- 申请人: Srikanteswara Dakshina-Murthy , Paul R. Besser
- 主分类号: H01L213205
- IPC分类号: H01L213205
摘要:
A metal gate structure and method of making the same provides a tracer layer over a first metal or metal compound layer. When etching a metal gate, formed of tungsten, for example, with a first etchant chemistry optimized for etching tungsten, detection of the tracer layer through optical emission spectroscopy, for example, indicates the imminent clearing of the tungsten. A second etchant chemistry is then employed that is selective to the first metal or metal compound layer, such as TiN, overlying the gate dielectric. This provides a controlled etching of the TiN and thereby prevents degradation of the underlying gate dielectric material.
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