Method and apparatus for electrical devices. An electronic assembly comprises at least one object having a first electrical circuitry therein. The object is created and separated from a host substrate. The assembly further comprises a receiving substrate having at least one recess. A bottom conducting layer is deposited over the receiving substrate and the recess. The object is then coupled to the receiving substrate such that the object is deposited on the bottom conducting layer and recessed within the first recess and below a surface of the receiving substrate. An insulation layer having a plurality of vias is disposed over the receiving substrate to insulate the bottom conducting layer and the object. A top conducting is deposited over the insulation layer and is making electrical interconnections to the bottom conducting layer and the object through the vias.