公开(公告)号：US06590346B1

公开(公告)日：2003-07-08

申请号：US09906627

申请日：2001-07-16

申请人： Mark Alfred Hadley ,  Randolph Wilfred Eisenhardt

发明人： Mark Alfred Hadley ,  Randolph Wilfred Eisenhardt

IPC分类号： G09G310

CPC分类号： H01L25/50 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L25/0655 ,  H01L27/3244 ,  H01L29/0657 ,  H01L51/52 ,  H01L2224/2413 ,  H01L2224/24225 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/95085 ,  H01L2224/95092 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2251/5338 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2224/82 ,  H01L2924/00

摘要： Method and apparatus for electrical devices. An electronic assembly comprises at least one object having a first electrical circuitry therein. The object is created and separated from a host substrate. The assembly further comprises a receiving substrate having at least one recess. A bottom conducting layer is deposited over the receiving substrate and the recess. The object is then coupled to the receiving substrate such that the object is deposited on the bottom conducting layer and recessed within the first recess and below a surface of the receiving substrate. An insulation layer having a plurality of vias is disposed over the receiving substrate to insulate the bottom conducting layer and the object. A top conducting is deposited over the insulation layer and is making electrical interconnections to the bottom conducting layer and the object through the vias.

摘要翻译： 电气设备的方法和装置。 电子组件包括至少一个物体，其中具有第一电路。 创建对象并与主机基板分离。 组件还包括具有至少一个凹部的接收衬底。 底部导电层沉积在接收衬底和凹部上。 然后将物体耦合到接收基板，使得物体沉积在底部导电层上并凹入第一凹槽内并在接收基板的表面下方。 具有多个通孔的绝缘层设置在接收衬底上，以使底部导电层和物体绝缘。 顶部导电层沉积在绝缘层上方，并通过通孔与底部导电层和物体进行电互连。