发明授权
US06593202B2 Semiconductor memory device and fabrication method thereof 失效
半导体存储器件及其制造方法

  • 专利标题: Semiconductor memory device and fabrication method thereof
  • 专利标题(中): 半导体存储器件及其制造方法
  • 申请号: US09909790
    申请日: 2001-07-23
  • 公开(公告)号: US06593202B2
    公开(公告)日: 2003-07-15
  • 发明人: Keiji HosotaniYusuke Kohyama
  • 申请人: Keiji HosotaniYusuke Kohyama
  • 优先权: JP7-185257 19950721; JP7-262633 19951011
  • 主分类号: H01L2120
  • IPC分类号: H01L2120
Semiconductor memory device and fabrication method thereof
摘要:
In a method of fabricating a COB DRAM cell, a polysilicon plug is formed on the source and drain in self-alignment with the gate electrode. A bit line contact and a storage electrode contact are formed on the polysilicon plug thereby to reduce the aspect ratio of both the bit line contact and the storage electrode contact. With the polysilicon plug formed in self-alignment with the gate electrode, short-circuiting of contacts of adjacent element regions and short-circuiting of the plugs of the source and drain will not occur, leading to high protection against misregistration. Moreover, an independent lithography process is not required for forming the polysilicon plug, and, therefore, the number of fabrication steps is reduced.
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