发明授权
US06595408B1 Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux prior to placement
有权
使用工具将焊球附接到BGA封装的方法，以在放置之前将焊球拾取并浸入焊剂中
- 专利标题： Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux prior to placement
- 专利标题（中）： 使用工具将焊球附接到BGA封装的方法，以在放置之前将焊球拾取并浸入焊剂中
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申请号： US09167763申请日： 1998-10-07
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公开(公告)号： US06595408B1公开(公告)日： 2003-07-22
- 发明人: Chad A. Cobbley , Michael B. Ball , Marjorie L. Waddel
- 申请人： Chad A. Cobbley , Michael B. Ball , Marjorie L. Waddel
- 主分类号： B23K3512
- IPC分类号： B23K3512
摘要：
An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. A ball pickup tool picks up balls with a vacuum suction from a fluidized ball reservoir and utilizes a puff of gas to release the solder ball(s) carried thereon to conductive sites of a substrate for bonding thereto. In another embodiment, the bond pads of a substrate are coated with a flux or adhesive and lowered into a fluidized ball reservoir for direct attachment of solder balls.