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1.发明授权Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux 失效使用工具将焊球附接到BGA封装的方法，以将焊球拾取并浸入焊剂中公开(公告)号：US06844216B2
公开(公告)日：2005-01-18
申请号：US10358630
申请日：2003-02-04
CPC分类号： H05K3/3478 , B23K3/0623 , B23K2101/40 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2924/00014 , H05K3/3489 , H05K2203/041 , H05K2203/082 , Y10T29/49146 , H01L2224/05599
摘要： A method of attaching solder balls to a BGA package using a ball pickup tool. An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. The ball pickup tool picks up balls with a vacuum suction from a fluidized ball reservoir and utilizes a puff of gas to release the solder ball(s) carried thereon to conductive sites of a substrate for bonding thereto. In another embodiment, the bond pads of a substrate are coated with a flux or adhesive and lowered into a fluidized ball reservoir for direct attachment of solder balls.
摘要翻译： 使用球形拾取工具将焊球附接到BGA封装的方法。 在第一衬底上形成一组焊球，用于与另一衬底上的导电部位相互连接。 球形拾取工具从流化球储存器中抽真空吸取球，并利用气泡将其上承载的焊球释放到衬底的导电部位以与其结合。 在另一个实施例中，衬底的接合焊盘涂覆有焊剂或粘合剂，并且下降到流化的球储存器中以直接附着焊球。
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2.发明授权Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux 失效用于使用工具将焊球附接到BGA封装的装置，以将焊球拾取并浸入助焊剂中公开(公告)号：US07644853B2
公开(公告)日：2010-01-12
申请号：US11243677
申请日：2005-10-05
IPC分类号： B23K5/00
CPC分类号： H05K3/3478 , B23K3/0623 , B23K2101/40 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2924/00014 , H05K3/3489 , H05K2203/041 , H05K2203/082 , Y10T29/49146 , H01L2224/05599
摘要： A method of attaching solder balls to a BGA package using a ball pickup tool is disclosed. An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. The ball pickup tool picks up solder balls with a vacuum suction from a fluidized ball reservoir and utilizes a puff of gas to release the solder ball(s) carried thereon to conductive sites of a substrate for bonding thereto. In another embodiment, the bond pads of a substrate are coated with a flux or adhesive and lowered into a fluidized ball reservoir for direct attachment of solder balls.
摘要翻译： 公开了一种使用球形拾取工具将焊球附接到BGA封装的方法。 在第一衬底上形成一组焊球，用于与另一衬底上的导电部位相互连接。 球形拾取工具从流化球储存器中抽真空吸取焊球，并利用气泡将其上承载的焊球释放到衬底的导电部位以与其结合。 在另一个实施例中，衬底的接合焊盘涂覆有焊剂或粘合剂，并且下降到流化的球储存器中以直接附着焊球。
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3.发明授权Method of locating conductive spheres utilizing screen and hopper of solder balls 有权使用焊球的筛网和料斗定位导电球的方法公开(公告)号：US07105432B2
公开(公告)日：2006-09-12
申请号：US10357825
申请日：2003-02-03
IPC分类号： H01L21/44
CPC分类号： H01L24/12 , H01L21/6835 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11005 , H01L2224/11334 , H01L2224/13099 , H01L2924/00014 , H01L2924/01013 , H01L2924/01032 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K3/3478 , H05K2203/0126 , H05K2203/041 , H05K2203/0557 , Y10T29/49144 , Y10T29/49149 , Y10T29/49211 , Y10T29/49222 , Y10T29/53178 , Y10T29/532 , H01L2224/05599
摘要： Methods for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop through the through-holes onto the bond pads. In one embodiment, the feed mechanism is a sphere hopper which crosses the entire through-hole pattern. In another embodiment, a shuttle plate fed spheres from a reservoir and reversibly moves about one-half of the pitch, moving from a non-discharge position to a discharge position.
摘要翻译： 使用具有定位在接合焊盘上方的通孔图案的模板将导电球放置在基底的预先焊接的焊盘上的方法。 导电球通过移动进给机构放置在通孔中，并且球体通过通孔落到接合垫上。 在一个实施例中，进给机构是穿过整个通孔图案的球形料斗。 在另一个实施例中，梭板从储存器供给球体并可逆地移动约一半的间距，从非排放位置移动到排出位置。
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4.发明授权Method of locating conductive spheres utilizing screen and hopper of solder balls 有权使用焊球的筛网和料斗定位导电球的方法公开(公告)号：US06268275B1
公开(公告)日：2001-07-31
申请号：US09168621
申请日：1998-10-08
IPC分类号： H01L2144
CPC分类号： H01L24/12 , H01L21/6835 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11005 , H01L2224/11334 , H01L2224/13099 , H01L2924/00014 , H01L2924/01013 , H01L2924/01032 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K3/3478 , H05K2203/0126 , H05K2203/041 , H05K2203/0557 , Y10T29/49144 , Y10T29/49149 , Y10T29/49211 , Y10T29/49222 , Y10T29/53178 , Y10T29/532 , H01L2224/05599
摘要： Apparatus and methods for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop through the through-holes onto the bond pads. In one embodiment, the feed mechanism is a sphere hopper which crosses the entire though-hole pattern. In another embodiment, a shuttle plate fed spheres from a reservoir and reversibly moves about one-half of the pitch, moving from a non-discharge position to a discharge position.
摘要翻译： 使用具有定位在接合焊盘上方的通孔图案的模板将导电球放置在衬底的预先焊接的焊盘上的装置和方法。 导电球通过移动进给机构放置在通孔中，并且球体通过通孔落到接合垫上。 在一个实施例中，进给机构是穿过整个通孔图案的球漏斗。 在另一个实施例中，梭板从储存器供给球体并可逆地移动约一半的间距，从非排放位置移动到排出位置。
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5.发明授权Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux 失效用于使用工具将焊球附接到BGA封装的装置，以将焊球拾取并浸入助焊剂中公开(公告)号：US06957760B2
公开(公告)日：2005-10-25
申请号：US10358849
申请日：2003-02-04
CPC分类号： H05K3/3478 , B23K3/0623 , B23K2101/40 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2924/00014 , H05K3/3489 , H05K2203/041 , H05K2203/082 , Y10T29/49146 , H01L2224/05599
摘要： A method of attaching solder balls to a BGA package using a ball pickup tool is disclosed. An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. The ball pickup tool picks up balls with a vacuum suction from a fluidized ball reservoir and utilizes a puff of gas to release the solder ball(s) carried thereon to conductive sites of a substrate for bonding thereto. In another embodiment, the bond pads of a substrate are coated with a flux or adhesive and lowered into a fluidized ball reservoir for direct attachment of solder balls.
摘要翻译： 公开了一种使用球形拾取工具将焊球附接到BGA封装的方法。 在第一衬底上形成一组焊球，用于与另一衬底上的导电部位相互连接。 球形拾取工具从流化球储存器中抽真空吸取球，并利用气泡将其上承载的焊球释放到衬底的导电部位以与其结合。 在另一个实施例中，衬底的接合焊盘涂覆有焊剂或粘合剂，并且下降到流化的球储存器中以直接附着焊球。
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6.发明授权System for locating conductive sphere utilizing screen and hopper of solder balls 失效使用焊球的筛网和料斗定位导电球的系统公开(公告)号：US07635079B1
公开(公告)日：2009-12-22
申请号：US09576727
申请日：2000-05-23
CPC分类号： H01L24/12 , H01L21/6835 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11005 , H01L2224/11334 , H01L2224/13099 , H01L2924/00014 , H01L2924/01013 , H01L2924/01032 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K3/3478 , H05K2203/0126 , H05K2203/041 , H05K2203/0557 , Y10T29/49144 , Y10T29/49149 , Y10T29/49211 , Y10T29/49222 , Y10T29/53178 , Y10T29/532 , H01L2224/05599
摘要： System for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop through the through-holes onto the bond pads. In one embodiment, the feed mechanism is a sphere hopper which crosses the entire through-hole pattern. In another embodiment, a shuttle plate fed spheres from a reservoir and reversibly moves about one-half of the pitch, moving from a non-discharge position to a discharge position.
摘要翻译： 用于使用具有定位在接合焊盘上方的通孔图案的模板将导电球放置在基底的预先焊接的焊盘上的系统。 导电球通过移动进给机构放置在通孔中，并且球体通过通孔落到接合垫上。 在一个实施例中，进给机构是穿过整个通孔图案的球形料斗。 在另一个实施例中，梭板从储存器供给球体并可逆地移动约一半的间距，从非排放位置移动到排出位置。
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7.发明授权Apparatus for locating conductive spheres utilizing screen and hopper of solder balls 失效用于使用焊球的筛网和漏斗定位导电球的装置公开(公告)号：US07275676B2
公开(公告)日：2007-10-02
申请号：US10977301
申请日：2004-10-29
IPC分类号： B23K31/02
CPC分类号： H01L24/12 , H01L21/6835 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11005 , H01L2224/11334 , H01L2224/13099 , H01L2924/00014 , H01L2924/01013 , H01L2924/01032 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K3/3478 , H05K2203/0126 , H05K2203/041 , H05K2203/0557 , Y10T29/49144 , Y10T29/49149 , Y10T29/49211 , Y10T29/49222 , Y10T29/53178 , Y10T29/532 , H01L2224/05599
摘要： Apparatus for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop through the through-holes onto the bond pads. In one embodiment, the feed mechanism is a sphere hopper which crosses the entire through-hole pattern. In another embodiment, a shuttle plate fed spheres from a reservoir and reversibly moves about one-half of the pitch, moving from a non-discharge position to a discharge position.
摘要翻译： 用于使用具有定位在接合焊盘上方的通孔图案的模板将导电球放置在衬底的预先焊接的焊盘上的装置。 导电球通过移动进给机构放置在通孔中，并且球体通过通孔落到接合垫上。 在一个实施例中，进给机构是穿过整个通孔图案的球形料斗。 在另一个实施例中，梭板从储存器供给球体并可逆地移动约一半的间距，从非排放位置移动到排出位置。
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8.发明授权Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux prior to placement 有权使用工具将焊球附接到BGA封装的方法，以在放置之前将焊球拾取并浸入焊剂中公开(公告)号：US06595408B1
公开(公告)日：2003-07-22
申请号：US09167763
申请日：1998-10-07
IPC分类号： B23K3512
CPC分类号： H05K3/3478 , B23K3/0623 , B23K2101/40 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2924/00014 , H05K3/3489 , H05K2203/041 , H05K2203/082 , Y10T29/49146 , H01L2224/05599
摘要： An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. A ball pickup tool picks up balls with a vacuum suction from a fluidized ball reservoir and utilizes a puff of gas to release the solder ball(s) carried thereon to conductive sites of a substrate for bonding thereto. In another embodiment, the bond pads of a substrate are coated with a flux or adhesive and lowered into a fluidized ball reservoir for direct attachment of solder balls.
摘要翻译： 在第一衬底上形成一组焊球，用于与另一衬底上的导电部位相互连接。 球形拾取工具从流化球储存器中抽真空吸取球，并利用气泡将其上承载的焊球释放到衬底的导电部位以与其结合。 在另一个实施例中，衬底的接合焊盘涂覆有焊剂或粘合剂，并且下降到流化的球储存器中以直接附着焊球。
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9.发明授权Method of locating conductive spheres utilizing screen and hopper of solder balls 失效使用焊球的筛网和料斗定位导电球的方法公开(公告)号：US06551917B2
公开(公告)日：2003-04-22
申请号：US09897808
申请日：2001-06-29
IPC分类号： H01L2144
CPC分类号： H01L24/12 , H01L21/6835 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11005 , H01L2224/11334 , H01L2224/13099 , H01L2924/00014 , H01L2924/01013 , H01L2924/01032 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K3/3478 , H05K2203/0126 , H05K2203/041 , H05K2203/0557 , Y10T29/49144 , Y10T29/49149 , Y10T29/49211 , Y10T29/49222 , Y10T29/53178 , Y10T29/532 , H01L2224/05599
摘要： Apparatus and methods for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop through the through-holes onto the bond pads. In one embodiment, the feed mechanism is a sphere hopper which crosses the entire through-hole pattern. In another embodiment, a shuttle plate fed spheres from a reservoir and reversibly moves about one-half of the pitch, moving from a non-discharge position to a discharge position.
摘要翻译： 使用具有定位在接合焊盘上方的通孔图案的模板将导电球放置在衬底的预先焊接的焊盘上的装置和方法。 导电球通过移动进给机构放置在通孔中，并且球体通过通孔落到接合垫上。 在一个实施例中，进给机构是穿过整个通孔图案的球形料斗。 在另一个实施例中，梭板从储存器供给球体并可逆地移动约一半的间距，从非排放位置移动到排出位置。
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10.发明授权Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux 失效用于使用工具将焊球附接到BGA封装的装置，以将焊球拾取并浸入助焊剂中公开(公告)号：US06533159B1
公开(公告)日：2003-03-18
申请号：US09639486
申请日：2000-08-14
IPC分类号： B23K500
CPC分类号： H05K3/3478 , B23K3/0623 , B23K2101/40 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2924/00014 , H05K3/3489 , H05K2203/041 , H05K2203/082 , Y10T29/49146 , H01L2224/05599
摘要： An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. A ball pickup tool picks up balls with a vacuum suction from a fluidized ball reservoir and utilizes a puff of gas to release the solder ball(s) carried thereon to conductive sites of a substrate for bonding thereto. In another embodiment, the bond pads of a substrate are coated with a flux or adhesive and lowered into a fluidized ball reservoir for direct attachment of solder balls.
摘要翻译： 在第一衬底上形成一组焊球，用于与另一衬底上的导电部位相互连接。 球形拾取工具从流化球储存器中抽真空吸取球，并利用气泡将其上承载的焊球释放到衬底的导电部位以与其结合。 在另一个实施例中，衬底的接合焊盘涂覆有焊剂或粘合剂，并且下降到流化的球储存器中以直接附着焊球。
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