Disclosed is an organometallic precursor for forming a metal pattern, having a structure defined by the following Formula 1, and a method of forming the metal pattern using the same, in which the conductive metal pattern is readily formed through an exposing step without using a photo-resist. L′—M—L  Formula 1 wherein, M is a transition metal selected from the group consisting of Ag, Au, Cu, Pd, Ni, and Pt; L is an imidazolylidene compound having a structure defined by the following Formula 2; and L′ is an imidazolylidene compound having a structure defined by the following Formula 2 or a &bgr;-diketonate compound having a structure defined by the following Formula 3: wherein, R1, R2, R3, and R4 are independently a hydrogen atom, or alkyl group, alkenyl group, alkynyl group, carboxyl group, alkoxy group, or ester group with 1 to 20 carbons, or aromatic hydrocarbon group with 6 to 20 carbons; and wherein, R5, R6, and R7 are independently a hydrogen atom, or alkyl group, alkenyl group, alkynyl group, carboxyl group, alkoxy group, or ester group with 1 to 20 carbons, or aromatic hydrocarbon group with 6 to 20 carbons.