An integrated circuit package fabricated by attaching a surface mount pin to a pin pad on a substrate using a Sn—Sb solder composition, where the quantity of Sb is in a range from 4 percent to 10 percent by weight. The Sn—Sb composition has a melting point above the melting point of commonly-used Sn—Pb solders. Thus, after the pins are surface mounted to the substrate, the pin integrity is not later compromised by assembly steps that reheat the substrate to a temperature sufficient to reflow the Sn—Pb solder. In one embodiment, the surface mount pins are attached to the bottom surface of an organic substrate using the Sn—Sb composition, and a flip-chip is attached to the top surface using Sn—Pb solder bumps. An integrated circuit package includes the substrate, the surface mount pins, and the Sn—Sb solder composition on the bonding surfaces of the pins.